Inventor · disambiguated record
Naotomi Takahashi
Also filed as: TAKAHASHI NAOTOMI
16 granted patents·5 pending applications·181 citations·filing 1985–2002
94Inventor score
Top patents by PatentIndex Score
21 records- 0180US6660406B2Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuitMITSUI MINING & SMELTING CO·Filed 2001·Granted Dec 9, 2003·26 cites·9 claims
- 0279US4640747AProcess for surface treatment of copper productMITSUI MINING & SMELTING CO·Filed 1985·Granted Feb 3, 1987·29 cites·7 claims
- 0377US6605369B1Surface-treated copper foil and method for producing the sameMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 12, 2003·19 cites·13 claims
- 0470US6478247B2Method for winding copper foil on core tubeMITSUI MINING & SMELTING CO·Filed 2001·Granted Nov 12, 2002·11 cites·20 claims
- 0569US6839219B2Laminate for forming capacitor layer and method for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2002·Granted Jan 4, 2005·21 cites·9 claims
- 0667US6649274B1Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Nov 18, 2003·13 cites·2 claims
- 0765US6544664B1Copper foil for printed wiring boardMITSUI MINING & SMELTING CO·Filed 2000·Granted Apr 8, 2003·12 cites·4 claims
- 0863US6902824B2Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the sameMITSUI MINING & SMELTING CO·Filed 2002·Granted Jun 7, 2005·9 cites·5 claims
- 0960US6533915B2Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Mar 18, 2003·4 cites·9 claims
- 1054US6716572B2Manufacturing process for printed wiring boardMITSUI MINING & SMELTING CO·Filed 2002·Granted Apr 6, 2004·5 cites·11 claims
- 1154US6479170B2Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Nov 12, 2002·5 cites·3 claims
- 1253US6585877B2Method of producing a surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Jul 1, 2003·4 cites·22 claims
- 1350US6616827B2Filtration method of copper electrolyteMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 9, 2003·5 cites·5 claims
- 1450US6579437B2Method of producing a surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Jun 17, 2003·3 cites·10 claims
- 1548US6322904B1Copper foil for printed circuit boardsMITSUI MINING & SMELTING CO·Filed 1997·Granted Nov 27, 2001·13 cites·11 claims
- 1647US6531045B2Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Mar 11, 2003·2 cites·15 claims
- 1743US2002015833A1Manufacturing method of electrodeposited copper foil and electrodeposited copper foilFiled 2001·Application pending·0 cites
- 1841US2002064019A1Cathode electrode material and rotating cathode drum for electrolytic copper foil production using the sameFiled 2001·Application pending·0 cites
- 1936US2003148136A1Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminateMITSUI MINING & SMELTING CO·Filed 2002·Application pending·0 cites
- 2035US2002004124A1Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring boardFiled 2001·Application pending·0 cites
- 2135US2003150308A1Blade for cutting copper foilFUJITA SATORU·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →