Inventor · disambiguated record
Richard J. Dischler
Also filed as: DISCHLER RICHARD · DISCHLER RICHARD J
26 granted patents·3 pending applications·208 citations·filing 1994–2023
94Inventor score
Top patents by PatentIndex Score
29 records- 0196US10228735B2Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2017·Granted Mar 12, 2019·18 cites·25 claims
- 0293US6311287B1Variable frequency clock control for microprocessor-based computer systemsCOMPAQ COMPUTER CORP·Filed 1994·Granted Oct 30, 2001·168 cites·10 claims
- 0390US11656662B2Layered super-reticle computing : architectures and methodsINTEL CORP·Filed 2021·Granted May 23, 2023·2 cites·19 claims
- 0487US10963022B2Layered super-reticle computing : architectures and methodsINTEL CORP·Filed 2020·Granted Mar 30, 2021·2 cites·25 claims
- 0586US10691182B2Layered super-reticle computing: architectures and methodsINTEL CORP·Filed 2019·Granted Jun 23, 2020·4 cites·25 claims
- 0681US10727160B2Thermal management componentINTEL CORP·Filed 2017·Granted Jul 28, 2020·3 cites·18 claims
- 0781US10263312B2Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boardsINTEL CORP·Filed 2016·Granted Apr 16, 2019·3 cites·22 claims
- 0879US11716826B2Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing deviceINTEL CORP·Filed 2019·Granted Aug 1, 2023·2 cites·19 claims
- 0978US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 1074US12150271B2Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing deviceINTEL CORP·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 1174US11026351B2Computing apparatus with closed cooling loopINTEL CORP·Filed 2015·Granted Jun 1, 2021·2 cites·20 claims
- 1269US10249925B2Dielectric waveguide bundle including a supporting feature for connecting first and second server boardsINTEL CORP·Filed 2016·Granted Apr 2, 2019·1 cites·22 claims
- 1366US12183961B2Methods for conductively coating millimeter waveguidesINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 1458US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 1558US2022029839A1Technologies for densely packaging network components for large scale indirect topologiesINTEL CORP·Filed 2021·Application pending·0 cites
- 1656US11095012B2Methods for conductively coating millimeter waveguidesINTEL CORP·Filed 2016·Granted Aug 17, 2021·0 cites·12 claims
- 1756US2019094925A1Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2018·Application pending·0 cites
- 1852US11153105B2Technologies for densely packaging network components for large scale indirect topologiesINTEL CORP·Filed 2017·Granted Oct 19, 2021·0 cites·19 claims
- 1952US11024933B2Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layerINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·23 claims
- 2052US10819445B2Waveguide and transceiver interference mitigationINTEL CORP·Filed 2018·Granted Oct 27, 2020·0 cites·19 claims
- 2151US11031666B2Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectricINTEL CORP·Filed 2016·Granted Jun 8, 2021·0 cites·13 claims
- 2250US10623106B2Orthogonal frequency division multiplexing single sideband transmission over a waveguideINTEL CORP·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 2349US11108433B2Single side band transmission over a waveguideINTEL CORP·Filed 2018·Granted Aug 31, 2021·0 cites·14 claims
- 2449US10891254B2Switchable topology processor tile and computing machineINTEL CORP·Filed 2017·Granted Jan 12, 2021·0 cites·22 claims
- 2545US10950919B2System comprising first and second servers interconnected by a plurality of joined waveguide sectionsINTEL CORP·Filed 2016·Granted Mar 16, 2021·0 cites·21 claims
- 2644US11269805B2Signal pathways in multi-tile processorsINTEL CORP·Filed 2018·Granted Mar 8, 2022·0 cites·14 claims
- 2744US10498379B2Wireless interconnects on flexible cables between computing platformsINTEL CORP·Filed 2015·Granted Dec 3, 2019·0 cites·20 claims
- 2843US11581272B2Contactless high-frequency interconnectINTEL CORP·Filed 2019·Granted Feb 14, 2023·0 cites·20 claims
- 2943US2020273824A1Transceiver die interconnect interfacesINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →