Inventor · disambiguated record
Yosuke Ishihara
Also filed as: ISHIHARA YOSUKE
17 granted patents·1 pending application·45 citations·filing 1976–2022
89Inventor score
Top patents by PatentIndex Score
18 records- 0191US10358704B2Composite body and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Jul 23, 2019·5 cites·6 claims
- 0282US10636723B2Heat dissipation component and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Apr 28, 2020·1 cites·4 claims
- 0378US10640853B2Aluminum-diamond-based composite and heat dissipation componentDENKA COMPANY LTD·Filed 2016·Granted May 5, 2020·1 cites·17 claims
- 0473US8890189B2Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the waferHIROTSURU HIDEKI·Filed 2010·Granted Nov 18, 2014·2 cites·19 claims
- 0573US4027750AFloating disc brake including air escape structureSUMITOMO ELECTRIC INDUSTRIES·Filed 1976·Granted Jun 7, 1977·22 cites·6 claims
- 0670US11903168B2Heat dissipation memberDENKA COMPANY LTD·Filed 2019·Granted Feb 13, 2024·1 cites·10 claims
- 0767US10541189B2Heat dissipation component for semiconductor elementDENKA COMPANY LTD·Filed 2017·Granted Jan 21, 2020·1 cites·8 claims
- 0863US10751912B2Aluminum-diamond-based composite and method for producing sameDENKA COMPANY LTD·Filed 2016·Granted Aug 25, 2020·1 cites·9 claims
- 0962US10302375B2Aluminum-diamond composite, and heat dissipating component using sameDENKA COMPANY LTD·Filed 2015·Granted May 28, 2019·1 cites·5 claims
- 1061US11912489B2Package accommodating heat dissipation substrate and packing boxDENKA COMPANY LTD·Filed 2019·Granted Feb 27, 2024·0 cites·11 claims
- 1159US11682604B2Heat dissipation component and method for manufacturing sameDENKA COMPANY LTD·Filed 2020·Granted Jun 20, 2023·0 cites·6 claims
- 1256US12303973B2Production method for aluminum-diamond compositeDENKA COMPANY LTD·Filed 2022·Granted May 20, 2025·0 cites·13 claims
- 1352US4042074APin connection for a floating type disc brakeSUMITOMO ELECTRIC INDUSTRIES·Filed 1976·Granted Aug 16, 1977·10 cites·2 claims
- 1446US9387532B2Composite substrate for LED light emitting element, method of production of same, and LED light emitting elementHIROTSURU HIDEKI·Filed 2010·Granted Jul 12, 2016·0 cites·13 claims
- 1543US9524918B2Heat dissipating component for semiconductor elementHIROTSURU HIDEKI·Filed 2012·Granted Dec 20, 2016·0 cites·9 claims
- 1642US9299888B2Clad material for LED light-emitting element holding substrate, and method for manufacturing sameISHIHARA YOSUKE·Filed 2012·Granted Mar 29, 2016·0 cites·13 claims
- 1735US10539379B2Heat dissipation component for semiconductor elementDENKA COMPANY LTD·Filed 2015·Granted Jan 21, 2020·0 cites·16 claims
- 1831US2017092560A1Semiconductor package and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →