Inventor · disambiguated record
Mohsen Haji-Rahim
Also filed as: HAJI-RAHIM MOHSEN
8 granted patents·1 pending application·23 citations·filing 2006–2024
82Inventor score
Top patents by PatentIndex Score
9 records- 0182US9807890B2Electronic modules having grounded electromagnetic shieldsRF MICRO DEVICES INC·Filed 2013·Granted Oct 31, 2017·8 cites·25 claims
- 0278US10410972B2Integrated module with electromagnetic shieldingQORVO US INC·Filed 2018·Granted Sep 10, 2019·2 cites·17 claims
- 0374US7732253B1Flip-chip assembly with improved interconnectRF MICRO DEVICES INC·Filed 2006·Granted Jun 8, 2010·8 cites·20 claims
- 0472US11139250B2Integrated module with electromagnetic shieldingQORVO US INC·Filed 2019·Granted Oct 5, 2021·1 cites·15 claims
- 0567US11784136B2Integrated module with electromagnetic shieldingQORVO US INC·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 0667US9583471B2Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the sameRF MICRO DEVICES INC·Filed 2015·Granted Feb 28, 2017·2 cites·20 claims
- 0761US2025070042A1Module level compartmental integrated shieldingQORVO US INC·Filed 2024·Application pending·0 cites
- 0859US8959757B2Method of manufacturing an electronic moduleDANG THONG·Filed 2011·Granted Feb 24, 2015·2 cites·21 claims
- 0951US9936578B2Redistribution layer system in packageRF MICRO DEVICES INC·Filed 2014·Granted Apr 3, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →