Inventor · disambiguated record
Jeong-Gi Jin
Also filed as: JIN JEONG-GI
11 granted patents·3 pending applications·135 citations·filing 2008–2022
87Inventor score
Top patents by PatentIndex Score
14 records- 0197US7843072B1Semiconductor package having through holesAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·103 cites·20 claims
- 0290US9214411B2Integrated circuit devices including a through-silicon via structure and methods of fabricating the samePARK JAE-HWA·Filed 2014·Granted Dec 15, 2015·12 cites·15 claims
- 0389US9735090B2Integrated circuit devices having through-silicon vias and methods of manufacturing such devicesCHOI JU-IL·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 0483US10833032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·3 cites·20 claims
- 0582US11469202B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·20 claims
- 0675US8987869B2Integrated circuit devices including through-silicon-vias having integral contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·4 cites·5 claims
- 0771US11798906B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 0871US10483224B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·20 claims
- 0961US11251144B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·23 claims
- 1059US9240366B2Semiconductor device, semiconductor package, and electronic systemSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 19, 2016·1 cites·23 claims
- 1154US2023026211A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1243US2014329382A1Method of fabricating semiconductor device having bumpSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1342US2014145327A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1441US9082680B2Joint structures having organic preservative filmsCHOI JU-IL·Filed 2012·Granted Jul 14, 2015·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →