Inventor · disambiguated record
Dieu-Huong Nguyen Tran
Also filed as: TRAN DIEU-HUONG NGUYEN
3 granted patents·32 citations·filing 2004–2013
63Inventor score
Technology areasH05K
Top patents by PatentIndex Score
3 records- 0182US7645940B2Substrate with via and pad structuresSOLECTRON CORP·Filed 2004·Granted Jan 12, 2010·32 cites·28 claims
- 0253US9089063B2Method of reducing solder wicking on a substrateFLEXTRONICS AP LLC·Filed 2013·Granted Jul 21, 2015·0 cites·20 claims
- 0352US8378222B2Method of reducing solder wicking on a substrateFLEXTRONICS AP LLC·Filed 2009·Granted Feb 19, 2013·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →