Inventor · disambiguated record
Shinzo Ishibe
Also filed as: ISHIBE SHINZO
17 granted patents·5 pending applications·134 citations·filing 2002–2023
92Inventor score
Files withSANYO ELECTRIC CO9SEMICONDUCTOR COMPONENTS IND LLC6NOMA TAKASHI2HORIKOSHI KATSU1ISHIBE SHINZO1
Top patents by PatentIndex Score
22 records- 0194US9640497B1Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 2, 2017·10 cites·15 claims
- 0291US8102039B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jan 24, 2012·25 cites·8 claims
- 0391US7508072B2Semiconductor device with pad electrode for testing and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Mar 24, 2009·19 cites·13 claims
- 0491US7371693B2Manufacturing method of semiconductor device with chamferingSANYO ELECTRIC CO·Filed 2004·Granted May 13, 2008·40 cites·8 claims
- 0583US7633133B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 15, 2009·12 cites·10 claims
- 0679US7986021B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Jul 26, 2011·9 cites·12 claims
- 0775US7575994B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Aug 18, 2009·7 cites·4 claims
- 0866US7589388B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Sep 15, 2009·3 cites·4 claims
- 0964US8686526B2Semiconductor device and method of manufacturing the sameKITAGAWA KATSUHIKO·Filed 2007·Granted Apr 1, 2014·4 cites·15 claims
- 1063US7981807B2Manufacturing method of semiconductor device with smoothingSANYO ELECTRIC CO·Filed 2008·Granted Jul 19, 2011·0 cites·9 claims
- 1162US9034729B2Semiconductor device and method of manufacturing the sameYAMADA HIROSHI·Filed 2007·Granted May 19, 2015·1 cites·9 claims
- 1261US8809076B2Semiconductor device and method of automatically inspecting an appearance of the sameSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Aug 19, 2014·1 cites·19 claims
- 1359US2024128215A1Semiconductor device with stacked conductive layers and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1459US2024404879A1Electroless plating methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1557US8766408B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jul 1, 2014·1 cites·11 claims
- 1656US2024290736A1Molded thin semiconductor die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1750US10600736B2Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 24, 2020·0 cites·16 claims
- 1847US8653529B2Semiconductor device and method of manufacturing the sameISHIBE SHINZO·Filed 2011·Granted Feb 18, 2014·0 cites·10 claims
- 1945US6674114B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2002·Granted Jan 6, 2004·2 cites·5 claims
- 2042US2006289991A1Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2137US8410577B2Semiconductor deviceHORIKOSHI KATSU·Filed 2008·Granted Apr 2, 2013·0 cites·9 claims
- 2236US2019148306A1Semiconductor backmetal and over pad metallization structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →