Inventor · disambiguated record
Lin-Yin Wong
Also filed as: WONG LIN-YIN
8 granted patents·2 pending applications·193 citations·filing 2003–2008
89Inventor score
Top patents by PatentIndex Score
10 records- 0191US7507915B2Stack structure of carrier boards embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·31 cites·3 claims
- 0290US7968991B2Stacked package module and board having exposed endsUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 28, 2011·32 cites·16 claims
- 0390US7656015B2Packaging substrate having heat-dissipating structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Feb 2, 2010·24 cites·16 claims
- 0490US7050304B2Heat sink structure with embedded electronic components for semiconductor packagePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted May 23, 2006·64 cites·4 claims
- 0584US7396753B2Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 8, 2008·14 cites·7 claims
- 0679US7880296B2Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereonUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Feb 1, 2011·10 cites·12 claims
- 0770US7135377B1Semiconductor package substrate with embedded resistors and method for fabricating samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 14, 2006·5 cites·10 claims
- 0866US7323762B2Semiconductor package substrate with embedded resistors and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Jan 29, 2008·13 cites·5 claims
- 0941US2008230886A1Stacked package modulePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1037US2004099961A1Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →