Inventor · disambiguated record
Chia-Chieh Hu
Also filed as: HU CHIA-CHIEH
7 granted patents·7 pending applications·36 citations·filing 2000–2023
82Inventor score
Top patents by PatentIndex Score
14 records- 0190US11521939B2Semiconductor device structure having stiffener with two or more contact points for heat dissipating elementADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 6, 2022·4 cites·8 claims
- 0259US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0356US12114460B2Outdoor electronic devicePEGATRON CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0452US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0551US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 0651US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0749US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 0843US2006108693A1Solder for fabricating solder bumps and pumping processCHENG YI-HSIUN·Filed 2005·Application pending·0 cites
- 0943US2009170244A1Method for manufacturing a flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1040US2007216003A1Semiconductor package with enhancing layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1134US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 1234US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 1332US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 1431US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chia-Chieh Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →