Inventor · disambiguated record
Wen-Lo Shieh
Also filed as: SHIEH WEN-LO
6 granted patents·12 pending applications·30 citations·filing 2000–2007
79Inventor score
Top patents by PatentIndex Score
18 records- 0167US7952153B2Differential pressure sensing device and fabricating method thereforIND TECH RES INST·Filed 2007·Granted May 31, 2011·4 cites·8 claims
- 0259US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0352US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0451US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 0551US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0634US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 0734US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 0833US2003057540A1Combination-type 3D stacked IC packageFiled 2002·Application pending·0 cites
- 0932US2004032021A1Structure of a heat dissipation finFiled 2003·Application pending·0 cites
- 1032US2002056741A1Application of wire bonding technology on wafer bump, wafer level chip scale package structure and the method of manufacturing the sameFiled 2001·Application pending·0 cites
- 1132US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 1232US2003160316A1Open-type multichips stack packagingFiled 2003·Application pending·0 cites
- 1331US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 1431US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
- 1530US6600216B1Structure of a pin platform for integrated circuitORIENT SEMICONDUCTOR ELECT LTD·Filed 2002·Granted Jul 29, 2003·0 cites·1 claims
- 1630US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
- 1730US2002062971A1Ultra-thin-film packageFiled 2001·Application pending·0 cites
- 1829US2003160320A1High heat dissipation micro-packaging body for semiconductor chipFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →