Inventor · disambiguated record
Kazuhiro Tada
Also filed as: TADA KAZUHIRO
29 granted patents·8 pending applications·170 citations·filing 1983–2025
95Inventor score
Top patents by PatentIndex Score
37 records- 0193US12403749B2Air conditionerDENSO CORP·Filed 2023·Granted Sep 2, 2025·2 cites·8 claims
- 0292US4768171AMemory circuit having a plurality of cell arraysNEC CORP·Filed 1985·Granted Aug 30, 1988·79 cites·13 claims
- 0387US10889163B2Heat pump systemDENSO CORP·Filed 2017·Granted Jan 12, 2021·4 cites·4 claims
- 0484US12038207B2Refrigeration cycle deviceDENSO CORP·Filed 2021·Granted Jul 16, 2024·1 cites·6 claims
- 0579US5589596AProcess for producing aminesSUMITOMO CHEMICAL CO·Filed 1994·Granted Dec 31, 1996·16 cites·32 claims
- 0676US8894242B2Electronic device casing with a water inhibitorTADA KAZUHIRO·Filed 2012·Granted Nov 25, 2014·6 cites·6 claims
- 0775US8741695B2Semiconductor device and method of manufacturing the sameOKA SEIJI·Filed 2012·Granted Jun 3, 2014·3 cites·5 claims
- 0872US10843933B2Friction material composition, friction material, and friction memberOTSUKA CHEMICAL CO LTD·Filed 2018·Granted Nov 24, 2020·1 cites·8 claims
- 0971US10533786B2Refrigerating cycle apparatusDENSO CORP·Filed 2017·Granted Jan 14, 2020·1 cites·4 claims
- 1071US8193633B2Heat conductive sheet and method for producing same, and powder moduleMIMURA KENJI·Filed 2008·Granted Jun 5, 2012·6 cites·7 claims
- 1170US7151311B2Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layerMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 19, 2006·19 cites·4 claims
- 1270US4612394AProcess for producing aminophenyl-β-hydroxyethylsulfoneSUMITOMO CHEMICAL CO·Filed 1983·Granted Sep 16, 1986·11 cites·11 claims
- 1365US9129885B2Power semiconductor moduleNAKAYAMA YASUSHI·Filed 2011·Granted Sep 8, 2015·2 cites·20 claims
- 1462US2025264590A1VehicleHONDA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 1560US11279828B2Silicone rubber composite material and vibration isolating memberDENSO CORP·Filed 2018·Granted Mar 22, 2022·0 cites·7 claims
- 1660US9390995B2Semiconductor device and method of manufacturing the sameYAMAMOTO KEI·Filed 2012·Granted Jul 12, 2016·1 cites·19 claims
- 1759US10490491B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 26, 2019·1 cites·6 claims
- 1858US12151538B2Vehicle air conditionerDENSO CORP·Filed 2022·Granted Nov 26, 2024·0 cites·19 claims
- 1957US7671453B2Semiconductor device and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Mar 2, 2010·8 cites·8 claims
- 2055US12469761B2Power module including highly-heat-dissipating insulation adhesive sheetMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·10 claims
- 2155US9299628B2Power semiconductor moduleMIKI TAKAYOSHI·Filed 2012·Granted Mar 29, 2016·1 cites·20 claims
- 2253US7014330B2Lighted switch deviceALPS ELECTRIC CO LTD·Filed 2003·Granted Mar 21, 2006·6 cites·20 claims
- 2351US2022009312A1Vibration-isolating deviceDENSO CORP·Filed 2021·Application pending·0 cites
- 2448US2019316822A1Refrigeration cycle apparatusDENSO CORP·Filed 2019·Application pending·0 cites
- 2547US12080673B2Semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Sep 3, 2024·0 cites·8 claims
- 2647US8654544B2Electronic apparatusSUZUKI TAKASHI·Filed 2012·Granted Feb 18, 2014·0 cites·12 claims
- 2745US2019128569A1Ejector refrigeration circuitDENSO CORP·Filed 2018·Application pending·0 cites
- 2844US9320173B2Semiconductor device having a bulge portion and manufacturing method thereforYAMAMOTO KEI·Filed 2013·Granted Apr 19, 2016·0 cites·13 claims
- 2942US10177068B2Heat conductive insulating sheet, power module, and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 8, 2019·0 cites·12 claims
- 3042US4814460AProcess for preparing E-isomer of triazolyl styryl ketone derivativeSUMITOMO CHEMICAL CO·Filed 1987·Granted Mar 21, 1989·2 cites·15 claims
- 3140US10909908B2Image display devicePANASONIC AVC NETWORKS KUALA LUMPUR MALAYSIA SDN BHD·Filed 2017·Granted Feb 2, 2021·0 cites·9 claims
- 3240US2012252535A1Electronic apparatus and flexible substrateKAJIWARA YOSHIFUMI·Filed 2012·Application pending·0 cites
- 3338US2013077215A1Electronic equipmentTADA KAZUHIRO·Filed 2012·Application pending·0 cites
- 3436US2012039045A1Power module and method for detecting insulation degradation thereofYIN XIAOHONG·Filed 2010·Application pending·0 cites
- 3535US2012273244A1Electronic deviceTAKITA HIROYUKI·Filed 2012·Application pending·0 cites
- 3633US4904793ATriazole compounds, and their productionSUMITOMO CHEMICAL CO·Filed 1987·Granted Feb 27, 1990·0 cites·3 claims
- 3730US4814461AProcess for preparing E-isomer of a triazolyl styryl ketone derivativeSUMITOMO CHEMICAL CO·Filed 1987·Granted Mar 21, 1989·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →