Inventor · disambiguated record
Adeel Ahmad Bajwa
Also filed as: BAJWA ADEEL · BAJWA ADEEL A · BAJWA ADEEL AHMAD
11 granted patents·4 pending applications·17 citations·filing 2017–2024
83Inventor score
Top patents by PatentIndex Score
15 records- 0196US11205633B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2020·Granted Dec 21, 2021·6 cites·18 claims
- 0290US10861820B2Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machinesKULICKE & SOFFA IND INC·Filed 2019·Granted Dec 8, 2020·7 cites·24 claims
- 0388US11776933B2Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machinesKULICKE & SOFFA IND INC·Filed 2020·Granted Oct 3, 2023·2 cites·7 claims
- 0478US12381175B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0575US10930601B2Flexible fan-out wafer level process and structureUNIV CALIFORNIA·Filed 2017·Granted Feb 23, 2021·2 cites·20 claims
- 0672US12062636B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2023·Granted Aug 13, 2024·0 cites·22 claims
- 0772US2024266318A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0868US2024063169A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 0964US11616042B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1062US12500204B2Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Dec 16, 2025·0 cites·21 claims
- 1162US2025096193A1Methods of bonding semiconductor elements to substratesKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1259US2024332244A1Methods of processing a substrate on a bonding system, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1353US11515286B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2021·Granted Nov 29, 2022·0 cites·28 claims
- 1450US11239542B2Network on interconnect fabric and integrated antennaUNIV CALIFORNIA·Filed 2020·Granted Feb 1, 2022·0 cites·24 claims
- 1544US11257746B2Power distribution within silicon interconnect fabricUNIV CALIFORNIA·Filed 2018·Granted Feb 22, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →