Inventor · disambiguated record
Bartholomew Liao
Also filed as: LIAO BARTHOLOMEW
5 granted patents·1 pending application·25 citations·filing 2013–2021
73Inventor score
Technology areasH10W
Files withJCET SEMICONDUCTOR SHAOXING CO LTD2STATS CHIPPAC LTD2CAMACHO ZIGMUND RAMIREZ1SHIM IL KWON1
Top patents by PatentIndex Score
6 records- 0192US9330994B2Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuringSTATS CHIPPAC LTD·Filed 2014·Granted May 3, 2016·22 cites·21 claims
- 0269US9202793B1Integrated circuit packaging system with under bump metallization and method of manufacture thereofSHIM IL KWON·Filed 2013·Granted Dec 1, 2015·2 cites·10 claims
- 0368US12148677B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0461US9627338B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageSTATS CHIPPAC LTD·Filed 2014·Granted Apr 18, 2017·1 cites·24 claims
- 0550US11227809B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·25 claims
- 0640US2015179602A1Integrated circuit packaging system with conductive ink and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →