Inventor · disambiguated record
Darrel R. Frear
Also filed as: FREAR DARREL · FREAR DARREL R · FREAR DARREL RICHARD
17 granted patents·5 pending applications·483 citations·filing 1992–2014
95Inventor score
Top patents by PatentIndex Score
22 records- 0197US7651889B2Electromagnetic shield formation for integrated circuit die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 26, 2010·100 cites·20 claims
- 0295US7763976B2Integrated circuit module with integrated passive deviceFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 27, 2010·38 cites·19 claims
- 0395US6630725B1Electronic component and method of manufactureMOTOROLA INC·Filed 2000·Granted Oct 7, 2003·126 cites·25 claims
- 0488US7981730B2Integrated conformal shielding method and process using redistributed chip packagingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 19, 2011·17 cites·17 claims
- 0585US8742555B2Lead frame having a flag with in-plane and out-of-plane mold locking featuresWEN JIAN·Filed 2011·Granted Jun 3, 2014·8 cites·15 claims
- 0685US7838420B2Method for forming a packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 23, 2010·10 cites·13 claims
- 0783US8097494B2Method of making an integrated circuit package with shielding via ring structureTANG JINBANG·Filed 2010·Granted Jan 17, 2012·6 cites·16 claims
- 0883US6064293AThermal fuse for high-temperature batteriesSANDIA CORP·Filed 1997·Granted May 16, 2000·47 cites·8 claims
- 0979US9638597B2Differential pressure sensor assemblyHOOPER STEPHEN R·Filed 2014·Granted May 2, 2017·6 cites·20 claims
- 1079US5855323AMethod and apparatus for jetting, manufacturing and attaching uniform solder ballsSANDIA CORP·Filed 1996·Granted Jan 5, 1999·50 cites·17 claims
- 1178US7074647B2Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each otherFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 11, 2006·26 cites·15 claims
- 1277US9466413B2Die-to-die inductive communication devices and methodsBRAUCHLER FRED T·Filed 2013·Granted Oct 11, 2016·5 cites·15 claims
- 1377US8217511B2Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2007·Granted Jul 10, 2012·7 cites·11 claims
- 1469US9598280B2Environmental sensor structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 21, 2017·2 cites·20 claims
- 1557US9510495B2Electronic devices with cavity-type, permeable material filled packages, and methods of their manufactureHOOPER STEPHEN R·Filed 2012·Granted Nov 29, 2016·1 cites·10 claims
- 1657US5300307AMicrostructure control of Al-Cu films for improved electromigration resistanceUS ARMY·Filed 1992·Granted Apr 5, 1994·29 cites·18 claims
- 1744US2012252169A1Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2012·Application pending·0 cites
- 1844US2009072357A1Integrated shielding process for precision high density module packagingTANG JINBANG·Filed 2007·Application pending·0 cites
- 1942US2015004902A1Die-to-die inductive communication devices and methodsPIGOTT JOHN M·Filed 2013·Application pending·0 cites
- 2034US2002160187A1Tailorable fiber-reinforced support structure for use in precision manufacturingFiled 2001·Application pending·0 cites
- 2133US6140904AThermal disconnect for high-temperature batteriesSANDIA CORP·Filed 1999·Granted Oct 31, 2000·5 cites·10 claims
- 2231US2004016995A1MEMS control chip integrationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →