Inventor · disambiguated record
Yong-Jin Jung
Also filed as: JUNG YONG-JIN
7 granted patents·6 pending applications·49 citations·filing 2004–2016
83Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6HWANG HYUN-IK1HYUNDAI MOTOR CO LTD1JEONG HYECK-JIN1KOREA INST ENERGY RES1
Top patents by PatentIndex Score
13 records- 0189US9110896B2Active air flap apparatus for vehicle and defect diagnosis method thereofHYUNDAI MOTOR CO LTD·Filed 2013·Granted Aug 18, 2015·14 cites·11 claims
- 0287US7291925B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 6, 2007·19 cites·11 claims
- 0380US10115943B2Battery packing module and battery packKOREA INST ENERGY RES·Filed 2016·Granted Oct 30, 2018·2 cites·19 claims
- 0475US8937483B2Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the sameJEONG HYECK-JIN·Filed 2011·Granted Jan 20, 2015·7 cites·14 claims
- 0572US8692662B2Method of determining failure of active air flapSHIN HEE SUN·Filed 2012·Granted Apr 8, 2014·3 cites·9 claims
- 0668US7405105B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 29, 2008·4 cites·5 claims
- 0745US2009126979A1Semiconductor package circuit board and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0845US2010164101A1Ball land structure having barrier patternSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0940US2009166879A1Semiconductor packageSONG KUN-HO·Filed 2008·Application pending·0 cites
- 1040US2008049402A1Printed circuit board having supporting patternsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1137US2008136027A1Method of bonding wire of semiconductor packageMOON TAE-HO·Filed 2007·Application pending·0 cites
- 1236US7288436B2Semiconductor chip package manufacturing method including screen printing processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 30, 2007·0 cites·12 claims
- 1336US2006118831A1Semiconductor package and manufacturing method thereofHWANG HYUN-IK·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →