Inventor · disambiguated record
Gil-Beag Kim
Also filed as: KIM GIL-BEAG
3 granted patents·6 pending applications·23 citations·filing 2004–2013
64Inventor score
Top patents by PatentIndex Score
9 records- 0187US7291925B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 6, 2007·19 cites·11 claims
- 0268US7405105B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 29, 2008·4 cites·5 claims
- 0347US2009017583A1Double encapsulated semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0443US2007164407A1Double encapsulated semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0540US2008049402A1Printed circuit board having supporting patternsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0637US2008136027A1Method of bonding wire of semiconductor packageMOON TAE-HO·Filed 2007·Application pending·0 cites
- 0736US7288436B2Semiconductor chip package manufacturing method including screen printing processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 30, 2007·0 cites·12 claims
- 0836US2006118831A1Semiconductor package and manufacturing method thereofHWANG HYUN-IK·Filed 2005·Application pending·0 cites
- 0936US2013342236A1Test interface boards and test systemsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →