Inventor · disambiguated record
Kenji Toyosawa
Also filed as: TOYOSAWA KENJI
23 granted patents·4 pending applications·664 citations·filing 1994–2008
97Inventor score
Top patents by PatentIndex Score
27 records- 0194US7638854B2Semiconductor device, display module, and manufacturing method of semiconductor deviceSHARP KK·Filed 2006·Granted Dec 29, 2009·30 cites·36 claims
- 0291US6864562B1Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating filmSHARP KK·Filed 2000·Granted Mar 8, 2005·63 cites·14 claims
- 0388US6867490B2Semiconductor deviceSHARP KK·Filed 2003·Granted Mar 15, 2005·50 cites·15 claims
- 0488US6441474B2Semiconductor device and liquid crystal module adopting the sameSHARP KK·Filed 2001·Granted Aug 27, 2002·55 cites·27 claims
- 0584US6552419B2Semiconductor device and liquid crystal module using the sameSHARP KK·Filed 2001·Granted Apr 22, 2003·36 cites·13 claims
- 0684US6337257B1Semiconductor device and method of manufacturing the sameSHARP KK·Filed 2000·Granted Jan 8, 2002·31 cites·13 claims
- 0782US6388888B1Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the sameSHARP KK·Filed 2000·Granted May 14, 2002·29 cites·8 claims
- 0881US6518649B1Tape carrier type semiconductor device with gold/gold bonding of leads to bumpsSHARP KK·Filed 2000·Granted Feb 11, 2003·29 cites·13 claims
- 0981US6380620B1Tape ball grid array semiconductorSHARP KK·Filed 1999·Granted Apr 30, 2002·71 cites·27 claims
- 1080US7164205B2Semiconductor carrier film, and semiconductor device and liquid crystal module using the sameSHARP KK·Filed 2004·Granted Jan 16, 2007·32 cites·9 claims
- 1180US6650002B1Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating filmSHARP KK·Filed 2000·Granted Nov 18, 2003·25 cites·16 claims
- 1274US7193328B2Semiconductor deviceSHARP KK·Filed 2002·Granted Mar 20, 2007·19 cites·22 claims
- 1374US6441467B2Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating filmSHARP KK·Filed 1998·Granted Aug 27, 2002·39 cites·12 claims
- 1471US6060782ASemiconductor device with improved mounting on tape-shaped insulating substrateSHARP KK·Filed 1998·Granted May 9, 2000·44 cites·13 claims
- 1569US7582976B2Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module deviceSHARP KK·Filed 2007·Granted Sep 1, 2009·4 cites·12 claims
- 1668US7474008B2Semiconductor device with reduced electromigrationSHARP KK·Filed 2005·Granted Jan 6, 2009·6 cites·9 claims
- 1764US7768136B2Sealed-by-resin type semiconductor deviceSHARP KK·Filed 2006·Granted Aug 3, 2010·3 cites·13 claims
- 1863US6011315ASemiconductor device and film carrier tape and respective manufacturing methods thereofSHARP KK·Filed 1997·Granted Jan 4, 2000·33 cites·20 claims
- 1962US6509631B2Semiconductor device and liquid crystal moduleSHARP KK·Filed 2001·Granted Jan 21, 2003·10 cites·27 claims
- 2056US5424578ALead frame for use in a semiconductor device and a semiconductor device using the sameSHARP KK·Filed 1994·Granted Jun 13, 1995·23 cites·16 claims
- 2152US6670696B2Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereofSHARP KK·Filed 1998·Granted Dec 30, 2003·19 cites·18 claims
- 2244US6049121ATape carrier package and liquid crystal display device including such tape carrier packageSHARP KK·Filed 1997·Granted Apr 11, 2000·13 cites·15 claims
- 2342US8390104B2Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structureKUDOSE SATORU·Filed 2008·Granted Mar 5, 2013·0 cites·9 claims
- 2442US2005233613A1Coupling structure of electronic componentsNAITOH KATSUYUKI·Filed 2005·Application pending·0 cites
- 2541US2005206016A1Semiconductor device and manufacturing method thereof, and liquid crystal module and semiconductor module having the sameSHOHJI YASUSHI·Filed 2005·Application pending·0 cites
- 2637US2003209803A1Semiconductor device and display panel module incorporating thereofFiled 2003·Application pending·0 cites
- 2733US2006158861A1Semiconductor device and display module using sameSHOUJI YASUSHI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →