Inventor · disambiguated record
Norman A. Card
Also filed as: CARD JR NORMAN A · CARD NORMAN A
10 granted patents·3 pending applications·176 citations·filing 1991–2011
89Inventor score
Top patents by PatentIndex Score
13 records- 0193US5300402AComposition for photo imagingIBM·Filed 1991·Granted Apr 5, 1994·100 cites·14 claims
- 0283US7547577B2Method of making circuitized substrate with solder paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 16, 2009·13 cites·18 claims
- 0382US7169313B2Plating method for circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 30, 2007·13 cites·15 claims
- 0478US6349871B1Process for reworking circuit boardsIBM·Filed 2001·Granted Feb 26, 2002·24 cites·8 claims
- 0573US7211470B2Method and apparatus for depositing conductive paste in circuitized substrate openingsENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted May 1, 2007·6 cites·23 claims
- 0671US7910156B2Method of making circuitized substrate with selected conductors having solder thereonENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 22, 2011·6 cites·11 claims
- 0752US8288266B2Circuitized substrate assemblyCARD NORMAN A·Filed 2006·Granted Oct 16, 2012·1 cites·11 claims
- 0851US2006121722A1Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical componentsENDICOTT INTERCONNECT TECH INC·Filed 2006·Application pending·0 cites
- 0941US6216938B1Machine and process for reworking circuit boardsIBM·Filed 1999·Granted Apr 17, 2001·9 cites·10 claims
- 1038US2012243155A1Conductive metal nub for enhanced electrical interconnection, and information handling system utilizing sameMATIENZO LUIS J·Filed 2011·Application pending·0 cites
- 1135US2012228013A1Defective conductive surface pad repair for microelectronic circuit cardsMATIENZO LUIS J·Filed 2011·Application pending·0 cites
- 1234US6485892B1Method for masking a hole in a substrate during platingIBM·Filed 1999·Granted Nov 26, 2002·4 cites·13 claims
- 1328US8493173B2Method of cavity forming on a buried resistor layer using a fusion bonding processBHATT ASHWINKUMAR C·Filed 2011·Granted Jul 23, 2013·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →