Inventor · disambiguated record
Kazuhide Koyama
Also filed as: KOYAMA KAZUHIDE
14 granted patents·351 citations·filing 1992–2012
94Inventor score
Top patents by PatentIndex Score
14 records- 0182US5290731AAluminum metallization methodSONY CORP·Filed 1992·Granted Mar 1, 1994·73 cites·7 claims
- 0279US6043145AMethod for making multilayer wiring structureSONY CORP·Filed 1997·Granted Mar 28, 2000·66 cites·16 claims
- 0377US5981377ASemiconductor device with improved trench interconnected to connection plug mating and method of making sameSONY CORP·Filed 1998·Granted Nov 9, 1999·54 cites·10 claims
- 0475US7220645B2Method of manufacturing semiconductor deviceSONY CORP·Filed 2005·Granted May 22, 2007·5 cites·2 claims
- 0571US5864179AAluminum like metal wiring for semiconductor devicesSONY CORP·Filed 1996·Granted Jan 26, 1999·41 cites·12 claims
- 0670US9058978B2Memory device and method of manufacturing the sameKOYAMA KAZUHIDE·Filed 2012·Granted Jun 16, 2015·4 cites·19 claims
- 0768US7056774B2Method of manufacturing semiconductor deviceSONY CORP·Filed 2005·Granted Jun 6, 2006·3 cites·2 claims
- 0868US6908820B2Method of manufacturing semiconductor deviceSONY CORP·Filed 2003·Granted Jun 21, 2005·12 cites·2 claims
- 0964US5985751AProcess for fabricating interconnection of semiconductor deviceSONY CORP·Filed 1995·Granted Nov 16, 1999·29 cites·9 claims
- 1057US5776830AProcess for fabricating connection structuresSONY CORP·Filed 1997·Granted Jul 7, 1998·22 cites·3 claims
- 1155US6093654AProcess for forming interconnection of semiconductor device and sputtering system thereforSONY CORP·Filed 1997·Granted Jul 25, 2000·20 cites·6 claims
- 1250US6664165B2Semiconductor device and fabrication method thereforSONY CORP·Filed 2002·Granted Dec 16, 2003·4 cites·9 claims
- 1341US6197686B1Aluminum metallization by a barrier metal processSONY CORP·Filed 1993·Granted Mar 6, 2001·11 cites·4 claims
- 1436US5272110AMethod of forming wiringsSONY CORP·Filed 1992·Granted Dec 21, 1993·7 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →