Inventor · disambiguated record
Chun-Han Tsao
Also filed as: TSAO CHUN-HAN
15 granted patents·23 citations·filing 2012–2021
89Inventor score
Top patents by PatentIndex Score
15 records- 0189US9837291B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 0289US9754827B1Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·4 cites·20 claims
- 0383US10276678B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 0483US10177043B1Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·3 cites·20 claims
- 0581US9293392B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
- 0676US11735635B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0776US9059057B2Image sensor having compressive layersTSAO CHUN-HAN·Filed 2012·Granted Jun 16, 2015·2 cites·19 claims
- 0874US9252296B2Semiconductor device with compressive layersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 2, 2016·1 cites·20 claims
- 0966US11276587B2Wafer bonding method and apparatus with curved surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 1065US11069785B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 1163US10840287B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 1259US10504756B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 1359US10361234B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 1457US10535568B2Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 1555US9941320B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →