Inventor · disambiguated record
Yugaku Abe
Also filed as: ABE YUGAKU
13 granted patents·2 pending applications·136 citations·filing 1991–2010
92Inventor score
Top patents by PatentIndex Score
15 records- 0180US6388273B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 14, 2002·21 cites·1 claims
- 0277US7180178B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Feb 20, 2007·7 cites·25 claims
- 0375US6737168B1Composite material and semiconductor device using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 18, 2004·19 cites·12 claims
- 0472US6183874B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 6, 2001·28 cites·14 claims
- 0567US6534190B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Mar 18, 2003·9 cites·18 claims
- 0665US5448107ARadiating fin having an improved life and thermal conductivitySUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Sep 5, 1995·35 cites·12 claims
- 0764US8993121B2Metal laminated structure and method for producing the sameNITTA KOJI·Filed 2010·Granted Mar 31, 2015·2 cites·8 claims
- 0862US9199433B2Metal laminated structure and method for producing the metal laminated structureNITTA KOJI·Filed 2010·Granted Dec 1, 2015·2 cites·7 claims
- 0956US6974558B2Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMOTOMO ELECTRIC IND LTD·Filed 2001·Granted Dec 13, 2005·5 cites·9 claims
- 1044US6979901B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Dec 27, 2005·1 cites·20 claims
- 1142US2005025654A1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 1236US2006102373A1Member for semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Application pending·0 cites
- 1332US5132779AHousing for semiconductor device with occlusion gas removedSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jul 21, 1992·3 cites·5 claims
- 1431US5605558ANitrogenous aluminum-silicon powder metallurgical alloySUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Feb 25, 1997·3 cites·8 claims
- 1524US5275782AHousing for semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jan 4, 1994·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →