Inventor · disambiguated record
Kok Khoon Ho
Also filed as: HO KOK KHOON
8 granted patents·1 pending application·51 citations·filing 2000–2021
84Inventor score
Top patents by PatentIndex Score
9 records- 0195US9601461B2Semiconductor device and method of forming inverted pyramid cavity semiconductor packageSEMTECH CORP·Filed 2015·Granted Mar 21, 2017·26 cites·19 claims
- 0285US10410988B2Single-shot encapsulationSEMTECH CORP·Filed 2017·Granted Sep 10, 2019·4 cites·23 claims
- 0379US9875988B2Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillarsSEMTECH CORP·Filed 2015·Granted Jan 23, 2018·6 cites·25 claims
- 0475US9899285B2Semiconductor device and method of forming small Z semiconductor packageSEMTECH CORP·Filed 2015·Granted Feb 20, 2018·3 cites·25 claims
- 0572US12166001B2Single-shot encapsulationSEMTECH CORP·Filed 2021·Granted Dec 10, 2024·0 cites·25 claims
- 0660US11171099B2Single-shot encapsulationSEMTECH CORP·Filed 2019·Granted Nov 9, 2021·0 cites·16 claims
- 0756US6383843B1Using removable spacers to ensure adequate bondline thicknessADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·8 cites·9 claims
- 0851US6547121B2Mechanical clamper for heated substrates at die attachADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 15, 2003·4 cites·10 claims
- 0946US2017133323A1Semiconductor Device and Method of Forming Inverted Pyramid Cavity Semiconductor PackageSEMTECH CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →