Inventor · disambiguated record
Tomoko Wake
Also filed as: WAKE TOMOKO
9 granted patents·5 pending applications·343 citations·filing 1998–2003
90Inventor score
Top patents by PatentIndex Score
14 records- 0194US6530968B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Mar 11, 2003·109 cites·19 claims
- 0291US6436811B1Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurryNEC CORP·Filed 2000·Granted Aug 20, 2002·60 cites·10 claims
- 0390US6585568B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·54 cites·8 claims
- 0488US6725119B1Cleaning-apparatus line configuration and designing process thereforNEC ELECTRONICS CORP·Filed 2000·Granted Apr 20, 2004·51 cites·20 claims
- 0573US6585786B2Slurry for chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·16 cites·18 claims
- 0669US6478834B2Slurry for chemical mechanical polishingNEC CORP·Filed 2001·Granted Nov 12, 2002·13 cites·17 claims
- 0767US6319801B1Method for cleaning a substrate and cleaning solutionNEC CORP·Filed 1998·Granted Nov 20, 2001·33 cites·16 claims
- 0853US6930037B2Process for forming a metal interconnectNEC ELECTRONICS CORP·Filed 2000·Granted Aug 16, 2005·6 cites·23 claims
- 0945US6867139B2Method of manufacturing semiconductor deviceNEC CORP·Filed 2002·Granted Mar 15, 2005·1 cites·13 claims
- 1041US2003211742A1CMP process for a damascene patternFiled 2003·Application pending·0 cites
- 1139US2002048958A1CMP process for a damascene patternFiled 2001·Application pending·0 cites
- 1234US2001006224A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 1334US2001005009A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 1433US2001006225A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →