Inventor · disambiguated record
John C. Fernandez
Also filed as: FERNANDEZ JOHN · FERNANDEZ JOHN C
5 granted patents·260 citations·filing 1998–2012
79Inventor score
Top patents by PatentIndex Score
5 records- 0192US6303985B1Semiconductor lead frame and package with stiffened mounting paddleMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 16, 2001·231 cites·38 claims
- 0272US7518237B2Microfeature systems including adhered microfeature workpieces and support membersMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 14, 2009·5 cites·13 claims
- 0359US6023666AIn-line method of monitoring die attach material adhesive weightMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 8, 2000·24 cites·85 claims
- 0446US9064973B2Die attached to a support member by a plurality of adhesive membersCLYNE CRAIG T·Filed 2012·Granted Jun 23, 2015·0 cites·20 claims
- 0541US8278751B2Methods of adhering microfeature workpieces, including a chip, to a support memberCLYNE CRAIG T·Filed 2005·Granted Oct 2, 2012·0 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →