Inventor · disambiguated record
Rikiya Kato
Also filed as: KATO RIKIYA
21 granted patents·5 pending applications·739 citations·filing 1987–2007
96Inventor score
Files withNIPPON OXYGEN CO LTD11KATO RIKIYA5SENJU METAL INDUSTRY CO5KIKUCHI TETSURO1SEIKO INSTR INC1
Top patents by PatentIndex Score
26 records- 0198USD408689SThermal insulating cup with lidNIPPON OXYGEN CO LTD·Filed 1998·Granted Apr 27, 1999·122 cites·1 claims
- 0296USD404613SCup with lidNIPPON OXYGEN CO LTD·Filed 1997·Granted Jan 26, 1999·73 cites·1 claims
- 0394USD417590SVacuum bottleNIPPON OXYGEN CO LTD·Filed 1998·Granted Dec 14, 1999·57 cites·1 claims
- 0493US6079589ADrinking receptacle coversNIPPON OXYGEN CO LTD·Filed 1999·Granted Jun 27, 2000·121 cites·3 claims
- 0592USD422455SVacuum bottleNIPPON OXYGEN CO LTD·Filed 1999·Granted Apr 11, 2000·43 cites·1 claims
- 0692USD366186SCup with lidNIPPON OXYGEN CO LTD·Filed 1994·Granted Jan 16, 1996·42 cites·1 claims
- 0791USD380124SInsulating food container with lidNIPPON OXYGEN CO LTD·Filed 1995·Granted Jun 24, 1997·43 cites·1 claims
- 0889USD409451SVacuum bottleNIPPON OXYGEN CO LTD·Filed 1998·Granted May 11, 1999·38 cites·1 claims
- 0981US8388724B2Solder pasteKATO RIKIYA·Filed 2007·Granted Mar 5, 2013·9 cites·9 claims
- 1079US6887319B2Residue-free solder pasteSENJU METAL INDUSTRY CO·Filed 2003·Granted May 3, 2005·23 cites·19 claims
- 1179US5039841AReflow furnaceSENJU METAL INDUSTRY CO·Filed 1988·Granted Aug 13, 1991·38 cites·6 claims
- 1277US4740252ASolder paste for electronic partsSENJU METAL INDUSTRY CO·Filed 1987·Granted Apr 26, 1988·38 cites·7 claims
- 1373US6935553B2Reflow soldering methodSHINKO SEIKI·Filed 2003·Granted Aug 30, 2005·22 cites·23 claims
- 1469US5904264AThermally insulated double-walled synthetic resin container and thermally insulated double-walled synthetic resin lidNIPPON OXYGEN CO LTD·Filed 1996·Granted May 18, 1999·24 cites·15 claims
- 1566US6036801AMethod for producing a thermally insulated double-walled synthetic resin container and lidNIPPON OXYGEN CO LTD·Filed 1997·Granted Mar 14, 2000·31 cites·27 claims
- 1663US8038011B2Waterproof cover and waterproof structure for a device having a recording portionSEIKO INSTR INC·Filed 2006·Granted Oct 18, 2011·2 cites·11 claims
- 1755US7425299B2Lead-free solder balls and method for the production thereofSENJU METAL INDUSTRY CO·Filed 2004·Granted Sep 16, 2008·4 cites·7 claims
- 1855USD409492SContainerNIPPON OXYGEN CO LTD·Filed 1998·Granted May 11, 1999·8 cites·1 claims
- 1949US8322453B2Sprinkler headKIKUCHI TETSURO·Filed 2005·Granted Dec 4, 2012·0 cites·6 claims
- 2049US2005248020A1Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2005·Application pending·0 cites
- 2145US10036479B2Alloy for a fusible plug and a fusible plugKATO RIKIYA·Filed 2005·Granted Jul 31, 2018·0 cites·14 claims
- 2242US2010291399A1Lid for a functional part and a process for its manufactureKATO RIKIYA·Filed 2007·Application pending·0 cites
- 2342US2004112474A1Lead-free solder ballFiled 2003·Application pending·0 cites
- 2441US2003003011A1Lead-free solder balls and method for the production thereofFiled 2002·Application pending·0 cites
- 2538US9175782B2Alloy for a fusible plug and a fusible plugKATO RIKIYA·Filed 2004·Granted Nov 3, 2015·1 cites·9 claims
- 2635US2007102481A1Solder pasteKATO RIKIYA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →