Inventor · disambiguated record
Shu Wu
Also filed as: WU SHU · WU SHU-MIN
8 granted patents·13 pending applications·7 citations·filing 2005–2025
76Inventor score
Top patents by PatentIndex Score
21 records- 0186US11387218B2Pad-out structure for semiconductor device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0279US12033966B2Contact pads of three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·17 claims
- 0371US2025015015A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0466US12136599B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 0563US7704648B2Color filter substrate and fabricating method thereofCHUNGHWA PICTURE TUBES LTD·Filed 2005·Granted Apr 27, 2010·4 cites·12 claims
- 0660US11710730B2Fabricating method of semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·8 claims
- 0758US2025248036A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0855US2024215241A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0955US2024164100A1Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1054US2025329690A1Managing high bandwidth memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1154US2025038044A1Managing conductive connections for semiconductive devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1253US11430775B2Semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·11 claims
- 1353US2025029954A1Semiconductor devices and manufacturing methods thereof, chip package structuresYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1453US2025300117A1Semiconductor package structures based on chip back wafer bondingYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1552US11424221B2Pad structures for semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·19 claims
- 1652US2024164090A1Semiconductor device and fabrication method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 1752US2025125310A1Semiconductor package structuresYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1851US2025290976A1Chip package structure, fabrication method and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1950US2023096141A1Seal ring structure in a semiconductor device and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2048US2024179902A1Memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2138US11862224B2Method for performing memory calibration, associated system on chip integrated circuit and non-transitory computer-readable mediumREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →