Inventor · disambiguated record
Huang-Hsien Chang
Also filed as: CHANG HUANG-HSIEN
21 granted patents·4 pending applications·3 citations·filing 2017–2025
89Inventor score
Files withADVANCED SEMICONDUCTOR ENG25
Top patents by PatentIndex Score
25 records- 0178US10741483B1Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 11, 2020·1 cites·20 claims
- 0277US12249583B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Mar 11, 2025·0 cites·18 claims
- 0376US11215762B2Optical device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 4, 2022·2 cites·19 claims
- 0474US2025210544A1Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0574US2024168238A1Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0673US11886015B2Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jan 30, 2024·0 cites·10 claims
- 0772US12040261B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·6 claims
- 0867US11262506B1Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 1, 2022·0 cites·8 claims
- 0966US2023027674A1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1065US11289411B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 29, 2022·0 cites·19 claims
- 1164US11631734B2Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 1263US11848143B2Electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 19, 2023·0 cites·18 claims
- 1363US2022128768A1Optical device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1459US11728282B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 15, 2023·0 cites·15 claims
- 1558US11495557B2Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 1657US10847602B2Vertical capacitor structure having capacitor in cavity and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 24, 2020·0 cites·18 claims
- 1756US11581123B2Inductor and circuit structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 14, 2023·0 cites·15 claims
- 1852US11410957B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·17 claims
- 1952US11411073B2Semiconductor package device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·17 claims
- 2052US11107881B2Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layerADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 31, 2021·0 cites·8 claims
- 2150US11621229B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 4, 2023·0 cites·19 claims
- 2248US11894340B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 6, 2024·0 cites·10 claims
- 2348US11862585B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 2, 2024·0 cites·8 claims
- 2446US10796987B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 6, 2020·0 cites·23 claims
- 2544US10344383B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 9, 2019·0 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when Huang-Hsien Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →