Inventor · disambiguated record
Yongqing Lan
Also filed as: LAN YONGQING
18 granted patents·4 pending applications·21 citations·filing 2010–2021
89Inventor score
Top patents by PatentIndex Score
22 records- 0186US10385236B2Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substratesBASF SE·Filed 2015·Granted Aug 20, 2019·5 cites·14 claims
- 0282US10899945B2Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substratesBASF SE·Filed 2016·Granted Jan 26, 2021·3 cites·20 claims
- 0380US8679980B2Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP processRAMAN VIJAY IMMANUEL·Filed 2010·Granted Mar 25, 2014·6 cites·24 claims
- 0475US11264250B2Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substratesBASF SE·Filed 2016·Granted Mar 1, 2022·2 cites·21 claims
- 0567US9828527B2Chemical-mechanical polishing compositions comprising N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acidBASF SE·Filed 2016·Granted Nov 28, 2017·1 cites·6 claims
- 0667US9765239B2Use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing at least one III-V materialBASF SE·Filed 2014·Granted Sep 19, 2017·2 cites·13 claims
- 0764US10392531B2Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this processRAMAN VIJAY IMMANUEL·Filed 2010·Granted Aug 27, 2019·2 cites·16 claims
- 0859US2021102093A1Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt comprising substratesBASF SE·Filed 2020·Application pending·0 cites
- 0951US2024032540A1Microparticle compositions comprising fungicidesBASF CORP·Filed 2021·Application pending·0 cites
- 1050US9862862B2Chemical-mechanical polishing compositions comprising polyethylene imineBASF SE·Filed 2014·Granted Jan 9, 2018·0 cites·11 claims
- 1149US2016009955A1Chemical-mechanical polishing compositions comprising n,n,n',n'-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acidBASF SE·Filed 2014·Application pending·0 cites
- 1247US10570316B2Chemical mechanical polishing (CMP) compositionBASF SE·Filed 2015·Granted Feb 25, 2020·0 cites·20 claims
- 1345US11993729B2Chemical mechanical polishing compositionBASF SE·Filed 2018·Granted May 28, 2024·0 cites·21 claims
- 1445US10090159B2Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymersBASF SE·Filed 2014·Granted Oct 2, 2018·0 cites·14 claims
- 1541US2016160083A1Cmp composition comprising abrasive particles containing ceriaBASF SE·Filed 2014·Application pending·0 cites
- 1640US11286402B2Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substratesBASF SE·Filed 2015·Granted Mar 29, 2022·0 cites·12 claims
- 1740US10738219B2Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substratesBASF SE·Filed 2015·Granted Aug 11, 2020·0 cites·14 claims
- 1838US10214663B2Chemical-mechanical polishing composition comprising organic/inorganic composite particlesBASF SE·Filed 2015·Granted Feb 26, 2019·0 cites·20 claims
- 1937US9028708B2Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this processRAMAN VIJAY IMMANUEL·Filed 2010·Granted May 12, 2015·0 cites·18 claims
- 2035US10407594B2Chemical mechanical polishing (CMP) composition comprising a polymeric polyamineNOLLER BASTIAN MARTEN·Filed 2012·Granted Sep 10, 2019·0 cites·12 claims
- 2134US8747687B2Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfacesRAMAN VIJAY IMMANUEL·Filed 2010·Granted Jun 10, 2014·0 cites·20 claims
- 2230US10227506B2Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germaniumBASF SE·Filed 2015·Granted Mar 12, 2019·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →