Inventor · disambiguated record
Min-Ok Na
Also filed as: NA MIN-OK
13 granted patents·4 pending applications·103 citations·filing 2007–2019
90Inventor score
Top patents by PatentIndex Score
17 records- 0198US8508954B2Systems employing a stacked semiconductor packageKWON HEUNG-KYU·Filed 2010·Granted Aug 13, 2013·60 cites·7 claims
- 0294US8829686B2Package-on-package assembly including adhesive containment elementSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 9, 2014·24 cites·19 claims
- 0384US9042115B2Stacked semiconductor packagesKWON HEUNG-KYU·Filed 2013·Granted May 26, 2015·4 cites·17 claims
- 0480US8426959B2Semiconductor package and method of manufacturing the samePARK JI-HYUN·Filed 2010·Granted Apr 23, 2013·5 cites·29 claims
- 0579US9040351B2Stack packages having fastening element and halogen-free inter-package connectorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·4 cites·20 claims
- 0679US8709879B2Method of forming a semiconductor packagePARK JI-HYUN·Filed 2013·Granted Apr 29, 2014·4 cites·12 claims
- 0765US10593652B2Stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 17, 2020·0 cites·17 claims
- 0865US9899294B2Thermal interface material layer and package-on-package device including the sameNA MIN OK·Filed 2013·Granted Feb 20, 2018·2 cites·18 claims
- 0960US10403606B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·17 claims
- 1059US10950521B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1157US9978721B2Apparatus for stacked semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 22, 2018·0 cites·15 claims
- 1255US10431522B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 1354US2015228627A1Stacked semiconductor packages, methods for fabricating the same, and /or systems employing the sameKWON HEUNG-KYU·Filed 2015·Application pending·0 cites
- 1447US2012280404A1Stack packages having fastening element and halogen-free inter-package connectorKWON HEUNG-KYU·Filed 2012·Application pending·0 cites
- 1545US9214484B2Image sensor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 15, 2015·0 cites·17 claims
- 1645US2008160724A1Method of dicingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1744US2008064215A1Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →