Inventor · disambiguated record
Kuo-Wei Li
Also filed as: LI KUO-WEI
5 granted patents·4 pending applications·6 citations·filing 2005–2021
68Inventor score
Files withUNIMICRON TECHNOLOGY CORP4MORTECH CORP2CORETRONIC CORP1TAIWAN SEMICONDUCTOR MFG1THINFLEX CORP1
Top patents by PatentIndex Score
9 records- 0185US7816169B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 19, 2010·5 cites·20 claims
- 0266US11600936B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Mar 7, 2023·0 cites·8 claims
- 0359US11114782B2Method of manufacturing circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 7, 2021·0 cites·4 claims
- 0451US9234085B2Polyimide film and polyimide laminate thereofMORTECH CORP·Filed 2013·Granted Jan 12, 2016·1 cites·26 claims
- 0551US2009133227A1Handle mechanismCORETRONIC CORP·Filed 2008·Application pending·0 cites
- 0648US2016073505A1Manufacturing method of multilayer flexible circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 0744US2007044910A1Polyimide based flexible copper clad laminates and method of producing the sameTHINFLEX CORP·Filed 2005·Application pending·0 cites
- 0844US2022240367A1Package structure having solder mask layer with low dielectric constant and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0940US9499664B2Polyimide polymer, polyimide film having the same and polyimide laminate having the sameMORTECH CORP·Filed 2015·Granted Nov 22, 2016·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →