Inventor · disambiguated record
Hisatsugu Tokunaga
Also filed as: TOKUNAGA HISATSUGU
10 granted patents·6 pending applications·10 citations·filing 2002–2021
80Inventor score
Top patents by PatentIndex Score
16 records- 0169US8828535B2Cover tapeTOKUNAGA HISATSUGU·Filed 2009·Granted Sep 9, 2014·2 cites·16 claims
- 0255US8453421B2Method of packaging record rolls of cover tape and packageTOKUNAGA HISATSUGU·Filed 2008·Granted Jun 4, 2013·2 cites·14 claims
- 0354US8453958B2Method of winding tape-like multi-layer film and wound article of tape-like multi-layer filmTOKUNAGA HISATSUGU·Filed 2009·Granted Jun 4, 2013·1 cites·5 claims
- 0453US9338906B2Cover filmSASAKI AKIRA·Filed 2011·Granted May 10, 2016·0 cites·15 claims
- 0552US9327880B2Cover filmSASAKI AKIRA·Filed 2012·Granted May 3, 2016·0 cites·6 claims
- 0652US8289810B2Winding state evaluation method for tape film and winding method for tape filmTOKUNAGA HISATSUGU·Filed 2008·Granted Oct 16, 2012·0 cites·8 claims
- 0751US7084516B2Surface protection filmDENKI KAGAKU KOGYO KK·Filed 2002·Granted Aug 1, 2006·5 cites·10 claims
- 0848US7544268B2Static electricity preventing method and member using the methodDENKI KAGAKU KOGYO KK·Filed 2003·Granted Jun 9, 2009·0 cites·5 claims
- 0947US2014037940A1Cover filmFUJIMURA TETSUO·Filed 2012·Application pending·0 cites
- 1045US2013199961A1Cover filmSASAKI AKIRA·Filed 2011·Application pending·0 cites
- 1142US9453146B2Cover tapeDENKA COMPANY LTD·Filed 2012·Granted Sep 27, 2016·0 cites·6 claims
- 1242US2023265317A1Cover tape and electronic component packageDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1342US2023271761A1Cover tape and electronic-component packageDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1442US2018304573A1Laminated sheet and formed containerDENKA COMPANY LTD·Filed 2016·Application pending·0 cites
- 1539US9662866B2Cover tapeSASAKI AKIRA·Filed 2011·Granted May 30, 2017·0 cites·16 claims
- 1639US2006022309A1Surface protective filmDENKI KAGAKU KOGYO KK·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →