Inventor · disambiguated record
Jenny J. Sun
Also filed as: SUN JENNY J
15 granted patents·3 pending applications·698 citations·filing 1996–2010
95Inventor score
Files withFARADAY TECH MARKETING GROUP11FARADAY TECHNOLOGY INC3GEBHART LAWRENCE E1TAYLOR E J1TAYLOR E JENNINGS1
Top patents by PatentIndex Score
18 records- 0196US6524461B2Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2001·Granted Feb 25, 2003·76 cites·78 claims
- 0293US6319384B1Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2000·Granted Nov 20, 2001·85 cites·24 claims
- 0393US6303014B1Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2000·Granted Oct 16, 2001·98 cites·32 claims
- 0493US6210555B1Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse platingFARADAY TECH MARKETING GROUP·Filed 1999·Granted Apr 3, 2001·88 cites·44 claims
- 0591US6402931B1Electrochemical machining using modulated reverse electric fieldsFARADAY TECH MARKETING GROUP·Filed 1998·Granted Jun 11, 2002·86 cites·17 claims
- 0691US6309528B1Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 1999·Granted Oct 30, 2001·73 cites·23 claims
- 0786US6203684B1Pulse reverse electrodeposition for metallization and planarization of a semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 1998·Granted Mar 20, 2001·86 cites·21 claims
- 0885US6652727B2Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 2002·Granted Nov 25, 2003·20 cites·57 claims
- 0983US8603315B2Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting depositTAYLOR E JENNINGS·Filed 2007·Granted Dec 10, 2013·3 cites·27 claims
- 1081US8329006B2Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during platingGEBHART LAWRENCE E·Filed 2009·Granted Dec 11, 2012·4 cites·27 claims
- 1180US6827833B2Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fieldsFARADAY TECH MARKETING GROUP·Filed 2001·Granted Dec 7, 2004·12 cites·28 claims
- 1279US6863793B2Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 2001·Granted Mar 8, 2005·11 cites·35 claims
- 1372US7553401B2Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during platingFARADAY TECHNOLOGY INC·Filed 2004·Granted Jun 30, 2009·7 cites·21 claims
- 1470US5804057AMethod of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resinFARADAY TECHNOLOGY INC·Filed 1996·Granted Sep 8, 1998·38 cites·14 claims
- 1567US6878259B2Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2001·Granted Apr 12, 2005·11 cites·24 claims
- 1641US2006207888A1Electrochemical etching of circuitry for high density interconnect electronic modulesTAYLOR E J·Filed 2006·Application pending·0 cites
- 1740US2005145506A1Electrochemical etching of circuitry for high density interconnect electronic modulesFiled 2003·Application pending·0 cites
- 1838US2011017608A1Electrochemical etching and polishing of conductive substratesFARADAY TECHNOLOGY INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →