Inventor · disambiguated record
Chandra Mohan Jha
Also filed as: JHA CHANDRA · JHA CHANDRA M · JHA CHANDRA MOHAN M · JHA Chandra Mohan
36 granted patents·12 pending applications·56 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
48 records- 0193US10121722B1Architecture material and process to improve thermal performance of the embedded die packageINTEL CORP·Filed 2017·Granted Nov 6, 2018·12 cites·25 claims
- 0292US11735552B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2019·Granted Aug 22, 2023·6 cites·20 claims
- 0391US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 0491US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 0586US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 0684US12347780B2Integrated circuit package with flipped high bandwidth memory deviceINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
- 0784US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0884US2025293117A1Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2025·Application pending·0 cites
- 0983US11456232B2Thermal assemblies for multi-chip packagesINTEL CORP·Filed 2018·Granted Sep 27, 2022·4 cites·22 claims
- 1080US2025096178A1Microelectronic package with solder array thermal interface material (sa-tim)INTEL CORP·Filed 2024·Application pending·0 cites
- 1179US12205915B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1279US11978689B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1378US12191220B2Hybrid interposer of glass and silicon to reduce thermal crosstalkINTEL CORP·Filed 2019·Granted Jan 7, 2025·2 cites·14 claims
- 1477US11894282B2Vented lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Feb 6, 2024·2 cites·20 claims
- 1577US9865521B2Copper nanorod-based thermal interface material (TIM)INTEL CORP·Filed 2017·Granted Jan 9, 2018·2 cites·9 claims
- 1675US11664293B2Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenariosINTEL CORP·Filed 2019·Granted May 30, 2023·2 cites·16 claims
- 1773US11694942B2Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal managementINTEL CORP·Filed 2018·Granted Jul 4, 2023·2 cites·15 claims
- 1871US10290561B2Thermal interfaces for integrated circuit packagesINTEL CORP·Filed 2016·Granted May 14, 2019·2 cites·13 claims
- 1968US11626395B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 2065US9601406B2Copper nanorod-based thermal interface material (TIM)JHA CHANDRA M·Filed 2013·Granted Mar 21, 2017·2 cites·21 claims
- 2164US10541190B2Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive materialINTEL CORP·Filed 2015·Granted Jan 21, 2020·1 cites·15 claims
- 2261US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 2357US11127727B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2019·Granted Sep 21, 2021·0 cites·18 claims
- 2456US11837519B2Heatsink cutout and insulating through silicon vias to cut thermal cross-talkINTEL CORP·Filed 2020·Granted Dec 5, 2023·0 cites·25 claims
- 2554US12021016B2Thermally enhanced silicon back end layers for improved thermal performanceINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·16 claims
- 2651US11854932B2Package wrap-around heat spreaderINTEL CORP·Filed 2019·Granted Dec 26, 2023·0 cites·26 claims
- 2751US11670561B23D buildup of thermally conductive layers to resolve die height differencesINTEL CORP·Filed 2019·Granted Jun 6, 2023·0 cites·25 claims
- 2851US11398414B2Sloped metal features for cooling hotspots in stacked-die packagesINTEL CORP·Filed 2018·Granted Jul 26, 2022·0 cites·11 claims
- 2950US11705417B2Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies levelINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·17 claims
- 3050US10461011B2Microelectronics package with an integrated heat spreader having indentationsINTEL CORP·Filed 2017·Granted Oct 29, 2019·0 cites·25 claims
- 3149US2022384306A1Thermal interface structure for integrated circuit device assembliesINTEL CORP·Filed 2021·Application pending·0 cites
- 3248US11756856B2Package architecture including thermoelectric cooler structuresINTEL CORP·Filed 2018·Granted Sep 12, 2023·0 cites·14 claims
- 3347US11658095B2Bump integrated thermoelectric coolerINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·15 claims
- 3447US11587843B2Thermal bump networks for integrated circuit device assembliesINTEL CORP·Filed 2018·Granted Feb 21, 2023·0 cites·20 claims
- 3547US11322456B2Die back side structures for warpage controlINTEL CORP·Filed 2017·Granted May 3, 2022·0 cites·20 claims
- 3646US11462457B2Using a thermoelectric cooler to reduce heat transfer between heat-conducting platesINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·18 claims
- 3746US2019214328A1Stacked die architectures with improved thermal managementEID FERAS·Filed 2018·Application pending·0 cites
- 3845US9530718B2DBF film as a thermal interface materialARORA HITESH·Filed 2012·Granted Dec 27, 2016·0 cites·11 claims
- 3945US2021280497A1Modular technique for die-level liquid coolingINTEL CORP·Filed 2020·Application pending·0 cites
- 4044US11508645B2Modular technique for die-level liquid coolingINTEL CORP·Filed 2017·Granted Nov 22, 2022·0 cites·13 claims
- 4144US11502017B2Effective heat conduction from hotspot to heat spreader through package substrateINTEL CORP·Filed 2018·Granted Nov 15, 2022·0 cites·21 claims
- 4244US2021104448A1Lateral heat removal for 3d stack thermal managementINTEL CORP·Filed 2019·Application pending·0 cites
- 4344US2020111720A1Dual side die packaging for enhanced heat dissipationINTEL CORP·Filed 2018·Application pending·0 cites
- 4443US2020411408A1Deflected-pillar composite compliant elongated micro-structure thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 4540US10607909B2Systems, methods, and apparatuses for implementing a thermal solution for 3D packagingINTEL CORP·Filed 2016·Granted Mar 31, 2020·0 cites·25 claims
- 4640US2020176352A1Die backside structures for enhancing liquid cooling of high power multi-chip package (mcp) diceINTEL CORP·Filed 2017·Application pending·0 cites
- 4740US2020312741A1Thermoelectric cooler to enhance thermal-mechanical package performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 4834US2017179000A1Thermoelectric cooler having a solderless electrodeINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →