Inventor · disambiguated record
Wai Wah Lee
Also filed as: LEE WAI WAH
3 granted patents·1 pending application·8 citations·filing 2004–2014
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0163US9314869B2Method of recovering a bonding apparatus from a bonding failureLEE WAI WAH·Filed 2012·Granted Apr 19, 2016·5 cites·15 claims
- 0262US9502374B2Automatic wire tail adjustment system for wire bondersSONG KENG YEW·Filed 2012·Granted Nov 22, 2016·3 cites·13 claims
- 0339US9620477B2Wire bonder and method of calibrating a wire bonderSONG KENG YEW·Filed 2014·Granted Apr 11, 2017·0 cites·9 claims
- 0430US2006011710A1Formation of a wire bond with enhanced pullASM TECH SINGAPORE PTE LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →