Inventor · disambiguated record
Keng Yew Song
Also filed as: SONG KENG YEW · SONG KENG YEW JAMES
27 granted patents·4 pending applications·142 citations·filing 1999–2023
95Inventor score
Files withASM TECH SINGAPORE PTE LTD17ASMPT SINGAPORE PTE LTD6SONG KENG YEW3SONG KENG YEW JAMES2ZHANG YUE2
Top patents by PatentIndex Score
31 records- 0191US11205937B2Driving system having reduced vibration transmissionASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Dec 21, 2021·12 cites·15 claims
- 0289US7568606B2Electronic device handler for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2006·Granted Aug 4, 2009·19 cites·15 claims
- 0386US7677431B2Electronic device handler for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Mar 16, 2010·14 cites·5 claims
- 0483US9640512B2Wire bonding apparatus comprising an oscillator mechanismASM TECH SINGAPORE PTE LTD·Filed 2015·Granted May 2, 2017·5 cites·20 claims
- 0579US9889521B2Method and system for pull testing of wire bondsASM TECH SINGAPORE PTE LTD·Filed 2014·Granted Feb 13, 2018·6 cites·28 claims
- 0676US11400495B2Automated particle removal system having angular adjustabilityASM TECH SINGAPORE PTE LTD·Filed 2020·Granted Aug 2, 2022·1 cites·7 claims
- 0776US8459530B2Automatic wire feeding method for wire bondersZHANG YUE·Filed 2009·Granted Jun 11, 2013·7 cites·6 claims
- 0875US9881891B1Method of forming three-dimensional wire loops and wire loops formed using the methodASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jan 30, 2018·3 cites·15 claims
- 0966US6749100B2Multiple-head wire-bonding systemASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 15, 2004·15 cites·22 claims
- 1065US8186562B1Apparatus for increasing coverage of shielding gas during wire bondingSONG KENG YEW JAMES·Filed 2010·Granted May 29, 2012·3 cites·17 claims
- 1165US6568581B2Detection of wire bonding failuresASM TECH SINGAPORE PTE LTD·Filed 2001·Granted May 27, 2003·18 cites·27 claims
- 1264US12442744B2Apparatus and method for calibrating a shear test toolASMPT SINGAPORE PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1362US12510451B2Method and apparatus for conducting shear tests on interconnect bondsASMPT SINGAPORE PTE LTD·Filed 2023·Granted Dec 30, 2025·0 cites·22 claims
- 1462US9502374B2Automatic wire tail adjustment system for wire bondersSONG KENG YEW·Filed 2012·Granted Nov 22, 2016·3 cites·13 claims
- 1561US10163845B2Method and apparatus for measuring a free air ball size during wire bondingSONG KENG YEW·Filed 2014·Granted Dec 25, 2018·2 cites·8 claims
- 1657US6827247B1Apparatus for detecting the oscillation amplitude of an oscillating objectASM TECH SINGAPORE PTE LTD·Filed 1999·Granted Dec 7, 2004·26 cites·27 claims
- 1756US8707550B2Bonding machine incorporating dual-track transfer mechanismSONG KENG YEW JAMES·Filed 2009·Granted Apr 29, 2014·2 cites·9 claims
- 1854US6572001B2Bonding systemASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 3, 2003·6 cites·10 claims
- 1953US12457399B2Camera module assemblyASMPT SINGAPORE PTE LTD·Filed 2023·Granted Oct 28, 2025·0 cites·17 claims
- 2052US2024194634A1Handling a fragile substrate for interconnect bondingASMPT SINGAPORE PTE LTD·Filed 2022·Application pending·0 cites
- 2151US2024347500A1Wire path plate having enhanced durability for wire bondingASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 2250US11543362B2Method for measuring the heights of wire interconnectionsASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 3, 2023·0 cites·10 claims
- 2350US11239197B2Wire bonding apparatus threading systemASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Feb 1, 2022·0 cites·23 claims
- 2446US11205634B2Bonding apparatus with replaceable bonding toolASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Dec 21, 2021·0 cites·18 claims
- 2546US11145620B2Formation of bonding wire vertical interconnectsASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Oct 12, 2021·0 cites·14 claims
- 2642US11017996B2Automated particle removal systemASM TECH SINGAPORE PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·13 claims
- 2742US2008073408A1Movable electronic flame-off device for a bonding apparatusKWAN KA SHING KENNY·Filed 2006·Application pending·0 cites
- 2841US11289446B2Multiple actuator wire bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Mar 29, 2022·0 cites·17 claims
- 2939US9620477B2Wire bonder and method of calibrating a wire bonderSONG KENG YEW·Filed 2014·Granted Apr 11, 2017·0 cites·9 claims
- 3037US2012132695A1Wire feeding apparatus for wire bondersZHANG YUE·Filed 2010·Application pending·0 cites
- 3134US11227779B2Apparatus and method for processing a semiconductor deviceASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jan 18, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →