Inventor · disambiguated record

Ela Mia Cadag

Also filed as: CADAG ELA MIA

22 granted patents·2 pending applications·70 citations·filing 2014–2024

93Inventor score

Technology areasH10W H10P H01L

Files withST MICROELECTRONICS INC24

Top patents by PatentIndex Score

24 records

0195US10079198B1QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2017·Granted Sep 18, 2018·34 cites·16 claims
0289US11557548B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2020·Granted Jan 17, 2023·2 cites·20 claims
0389US10109563B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2017·Granted Oct 23, 2018·6 cites·25 claims
0488US9953933B1Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor dieST MICROELECTRONICS INC·Filed 2017·Granted Apr 24, 2018·7 cites·19 claims
0585US9165867B1Semiconductor device with lead frame contact solder balls and related methodsST MICROELECTRONICS INC·Filed 2014·Granted Oct 20, 2015·7 cites·18 claims
0682US10128169B1Package with backside protective layer during molding to prevent mold flashing failureST MICROELECTRONICS INC·Filed 2017·Granted Nov 13, 2018·3 cites·16 claims
0781US10903172B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2019·Granted Jan 26, 2021·2 cites·22 claims
0880US10615104B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2018·Granted Apr 7, 2020·2 cites·17 claims
0979US12255076B2Method for manufacturing leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
1079US10957634B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2020·Granted Mar 23, 2021·1 cites·19 claims
1179US2025183135A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
1279US2025183136A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
1378US11069601B2Leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2019·Granted Jul 20, 2021·2 cites·15 claims
1472US9842794B2Semiconductor package with integrated heatsinkST MICROELECTRONICS INC·Filed 2015·Granted Dec 12, 2017·2 cites·24 claims
1571US11552007B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
1671US10529672B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2017·Granted Jan 7, 2020·1 cites·23 claims
1769US11929259B2Method for manufacturing leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
1864US12211774B2Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2020·Granted Jan 28, 2025·0 cites·18 claims
1963US10910295B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
2059US9324643B1Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the deviceST MICROELECTRONICS INC·Filed 2014·Granted Apr 26, 2016·1 cites·15 claims
2158US10541196B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2018·Granted Jan 21, 2020·0 cites·19 claims
2252US10461019B2Package with backside protective layer during molding to prevent mold flashing failureST MICROELECTRONICS INC·Filed 2018·Granted Oct 29, 2019·0 cites·19 claims
2347US11916090B2Tapeless leadframe package with exposed integrated circuit dieST MICROELECTRONICS INC·Filed 2021·Granted Feb 27, 2024·0 cites·7 claims
2440US9818675B2Semiconductor device including conductive clip with flexible leads and related methodsST MICROELECTRONICS INC·Filed 2015·Granted Nov 14, 2017·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →