Inventor · disambiguated record
Valerie Oberson
Also filed as: OBERSON VALERIE · OBERSON VALERIE A · OBERSON VALERIE ANNE · OBERSON VALÉRIE A
17 granted patents·6 pending applications·87 citations·filing 2004–2024
92Inventor score
Top patents by PatentIndex Score
23 records- 0192US7332424B2Fluxless solder transfer and reflow processIBM·Filed 2005·Granted Feb 19, 2008·27 cites·10 claims
- 0289US8003512B2Structure of UBM and solder bumps and methods of fabricationIBM·Filed 2009·Granted Aug 23, 2011·19 cites·19 claims
- 0387US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0478US8957531B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityBERNIER WILLIAM E·Filed 2011·Granted Feb 17, 2015·4 cites·17 claims
- 0574US7740713B2Flux composition and techniques for use thereofIBM·Filed 2004·Granted Jun 22, 2010·17 cites·30 claims
- 0671US7780801B2Flux composition and process for use thereofIBM·Filed 2006·Granted Aug 24, 2010·5 cites·7 claims
- 0766US9579738B2Flux composition and techniques for use thereofLEE KANG-WOOK·Filed 2011·Granted Feb 28, 2017·1 cites·7 claims
- 0865US9815149B2Flux composition and techniques for use thereofLEE KANG-WOOK·Filed 2012·Granted Nov 14, 2017·1 cites·5 claims
- 0965US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 1064US8197612B2Optimization of metallurgical properties of a solder jointBUSBY JAMES A·Filed 2008·Granted Jun 12, 2012·2 cites·15 claims
- 1162US8444774B2Flux composition and process for use thereofDUSCHESNE ERIC·Filed 2010·Granted May 21, 2013·2 cites·8 claims
- 1262US2025391811A1Utilizing formate shells for metal structures on integrated circuit componentsIBM·Filed 2024·Application pending·0 cites
- 1360US11177217B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 1459US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 1558US9899279B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityIBM·Filed 2014·Granted Feb 20, 2018·0 cites·10 claims
- 1656US10699972B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityIBM·Filed 2017·Granted Jun 30, 2020·0 cites·16 claims
- 1754US2015231721A1Flux Composition and Techniques for Use ThereofIBM·Filed 2015·Application pending·0 cites
- 1853US9808874B2Flux composition and techniques for use thereofLEE KANG-WOOK·Filed 2012·Granted Nov 7, 2017·0 cites·8 claims
- 1948US2009039140A1Solder Mold With Venting ChannelsBEZAMA RASCHID JOSE·Filed 2007·Application pending·0 cites
- 2048US2009039142A1Method for Forming a Solder Mold with Venting Channels and Method for Using the SameBEZAMA RASCHID JOSE·Filed 2007·Application pending·0 cites
- 2147US2024113060A1Heterogeneous solder bump structureSOC DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S E C·Filed 2021·Application pending·0 cites
- 2240US8268716B2Creation of lead-free solder joint with intermetallicsARVIN CHARLES L·Filed 2010·Granted Sep 18, 2012·0 cites·16 claims
- 2334US2005263571A1Injection molded continuously solidified solder method and apparatusBELANGER LUC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →