Inventor · disambiguated record
Patricia B. Smith
Also filed as: SMITH PATRICIA B · SMITH PATRICIA BEAUREGARD
28 granted patents·3 pending applications·1,370 citations·filing 1987–2008
97Inventor score
Files withTEXAS INSTRUMENTS INC30
Top patents by PatentIndex Score
31 records- 0198US4837113AMethod for depositing compound from group II-VITEXAS INSTRUMENTS INC·Filed 1988·Granted Jun 6, 1989·475 cites·16 claims
- 0296US4988533AMethod for deposition of silicon oxide on a waferTEXAS INSTRUMENTS INC·Filed 1988·Granted Jan 29, 1991·116 cites·10 claims
- 0395US6277733B1Oxygen-free, dry plasma process for polymer removalTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 21, 2001·268 cites·7 claims
- 0493US7179751B2Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materialsTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 20, 2007·22 cites·8 claims
- 0588US6599829B2Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallizationTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 29, 2003·39 cites·8 claims
- 0687US4877757AMethod of sequential cleaning and passivating a GaAs substrate using remote oxygen plasmaTEXAS INSTRUMENTS INC·Filed 1988·Granted Oct 31, 1989·83 cites·10 claims
- 0786US7476602B2N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 13, 2009·10 cites·12 claims
- 0884US6838300B2Chemical treatment of low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 4, 2005·34 cites·20 claims
- 0983US6713402B2Methods for polymer removal following etch-stop layer etchTEXAS INSTRUMENTS INC·Filed 2002·Granted Mar 30, 2004·35 cites·28 claims
- 1079US5157000AMethod for dry etching openings in integrated circuit layersTEXAS INSTRUMENTS INC·Filed 1991·Granted Oct 20, 1992·72 cites·20 claims
- 1177US6342446B1Plasma process for organic residue removal from copperTEXAS INSTRUMENTS INC·Filed 1999·Granted Jan 29, 2002·50 cites·4 claims
- 1274US6727185B1Dry process for post oxide etch residue removalTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 27, 2004·18 cites·18 claims
- 1364US7910936B2N2 based plasma treatment for enhanced sidewall smoothing and pore sealing of porous low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2008·Granted Mar 22, 2011·1 cites·17 claims
- 1464US6967173B2Hydrogen plasma photoresist strip and polymeric residue cleanup processs for low dielectric constant materialsTEXAS INSTRUMENTS INC·Filed 2001·Granted Nov 22, 2005·9 cites·29 claims
- 1564US5318666AMethod for via formation and type conversion in group II and group VI materialsTEXAS INSTRUMENTS INC·Filed 1993·Granted Jun 7, 1994·34 cites·18 claims
- 1662US6958294B2Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallizationTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 25, 2005·7 cites·5 claims
- 1760US7001848B1Hydrogen plasma photoresist strip and polymeric residue cleanup process for oxygen-sensitive materialsTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 21, 2006·25 cites·6 claims
- 1856US7067441B2Damage-free resist removal process for ultra-low-k processingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 27, 2006·5 cites·20 claims
- 1955US7253124B2Process for defect reduction in electrochemical platingTEXAS INSTRUMENTS INC·Filed 2001·Granted Aug 7, 2007·4 cites·9 claims
- 2054US7101788B2Semiconductor devices and methods of manufacturing such semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 5, 2006·4 cites·14 claims
- 2153US7232768B2Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materialsTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 19, 2007·0 cites·1 claims
- 2250US7344951B2Surface preparation method for selective and non-selective epitaxial growthTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 18, 2008·3 cites·27 claims
- 2350US6251771B1Hydrogen passivation of chemical-mechanically polished copper-containing layersTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 26, 2001·16 cites·11 claims
- 2448US7413994B2Hydrogen and oxygen based photoresist removal processTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 19, 2008·0 cites·40 claims
- 2546US5077092AMethod and apparatus for deposition of zinc sulfide filmsTEXAS INSTRUMENTS INC·Filed 1989·Granted Dec 31, 1991·9 cites·5 claims
- 2644US5017511AMethod for dry etching vias in integrated circuit layersTEXAS INSTRUMENTS INC·Filed 1989·Granted May 21, 1991·12 cites·33 claims
- 2743US4838984AMethod for etching films of mercury-cadmium-telluride and zinc sulfidTEXAS INSTRUMENTS INC·Filed 1987·Granted Jun 13, 1989·11 cites·34 claims
- 2840US2007184666A1Method for removing residue containing an embedded metalTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2938US4855160AMethod for passivating waferTEXAS INSTRUMENTS INC·Filed 1988·Granted Aug 8, 1989·8 cites·10 claims
- 3036US2004152296A1Hexamethyldisilazane treatment of low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 3135US2005045206A1Post-etch clean process for porous low dielectric constant materialsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →