Inventor · disambiguated record
Teng Hock Kuah
Also filed as: KUAH TENG H · KUAH TENG HOCK · KUAH TENG HOCK ERIC
29 granted patents·8 pending applications·173 citations·filing 2000–2024
95Inventor score
Files withASM TECH SINGAPORE PTE LTD25ASMPT SINGAPORE PTE LTD6LI ZILAN2ATM TECHNOLOGY SINGAPORE PTE L1HO SHU CHUEN1
Top patents by PatentIndex Score
37 records- 0188US6770163B1Mold and method for encapsulation of electronic deviceASM TECH SINGAPORE PTE LTD·Filed 2000·Granted Aug 3, 2004·81 cites·18 claims
- 0286US10115579B2Method for manufacturing wafer-level semiconductor packagesASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Oct 30, 2018·4 cites·20 claims
- 0386US8840726B2Apparatus for thin-film depositionLI ZILAN·Filed 2011·Granted Sep 23, 2014·7 cites·14 claims
- 0484US6877933B2Pellet feeding system for a molding machineASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Apr 12, 2005·24 cites·10 claims
- 0578US9279185B2Feed-through apparatus for a chemical vapour deposition deviceLI ZILAN·Filed 2012·Granted Mar 8, 2016·3 cites·15 claims
- 0676US10960583B2Molding system for applying a uniform clamping pressure onto a substrateASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Mar 30, 2021·3 cites·13 claims
- 0766US6988879B2Apparatus and method for reducing substrate warpageASM TECH SINGAPORE PTE LTD·Filed 2002·Granted Jan 24, 2006·12 cites·30 claims
- 0864US8011917B2Compression molding of an electronic deviceASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Sep 6, 2011·2 cites·15 claims
- 0964US7927087B2Method and apparatus for molding with reduced cull formationASM TECH SINGAPORE PTE LTD·Filed 2005·Granted Apr 19, 2011·1 cites·13 claims
- 1063US6869556B2Molding system for semiconductor packagesASM TECH SINGAPORE PTE LTD·Filed 2002·Granted Mar 22, 2005·5 cites·19 claims
- 1158US2025360559A1Wet-tack sintering method and apparatusASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 1256US6674165B2Mold for a semiconductor chipASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jan 6, 2004·9 cites·13 claims
- 1353US6752896B2Method of detaching a film of material from a substrateASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 22, 2004·6 cites·7 claims
- 1453US2024262019A1Molding apparatus having wedge driverASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 1552US7241414B2Method and apparatus for molding a semiconductor deviceASM TECH SINGAPORE PTE LTD·Filed 2004·Granted Jul 10, 2007·7 cites·20 claims
- 1652US6709252B2Molding apparatusASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Mar 23, 2004·1 cites·9 claims
- 1751US9427893B2Molding press and a platen for a molding pressSU JIAN XIONG·Filed 2014·Granted Aug 30, 2016·1 cites·24 claims
- 1849US11955347B2Encapsulation process for double-sided cooled packagesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 1948US6860731B2Mold for encapsulating a semiconductor chipASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Mar 1, 2005·5 cites·5 claims
- 2047US7618249B2Memory card molding apparatus and processASM TECH SINGAPORE PTE LTD·Filed 2006·Granted Nov 17, 2009·0 cites·14 claims
- 2147US2014284404A1Chemical vapour deposition injectorASM TECH SINGAPORE PTE LTD·Filed 2013·Application pending·0 cites
- 2245US11548273B2Apparatus and method for removing a film from a surfaceASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 10, 2023·0 cites·13 claims
- 2344US11676937B2Flexible sinter tool for bonding semiconductor devicesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 2444US6656320B2Removal of masking tape from lead framesASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Dec 2, 2003·2 cites·19 claims
- 2542US11621181B2Dual-sided molding for encapsulating electronic devicesASMPT SINGAPORE PTE LTD·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 2642US9346205B2Optical device molding systemHO SHU CHUEN·Filed 2009·Granted May 24, 2016·0 cites·17 claims
- 2741US2006105501A1Electronic device with high lead densityASM TECH SINGAPORE PTE LTD·Filed 2005·Application pending·0 cites
- 2840US6808661B2Method for encapsulating leadframe-mounted integrated circuitsASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Oct 26, 2004·0 cites·8 claims
- 2939US2018117813A1Molding apparatus including a compressible structureASM TECH SINGAPORE PTE LTD·Filed 2016·Application pending·0 cites
- 3037US2019006339A1Three-dimensional integrated fan-out wafer level packageASM TECH SINGAPORE PTE LTD·Filed 2017·Application pending·0 cites
- 3136US6736627B2Mold cleaning apparatusASM TECH SINGAPORE PTE LTD·Filed 2001·Granted May 18, 2004·0 cites·12 claims
- 3235US9199396B2Substrate carrier for molding electronic devicesKUAH TENG HOCK·Filed 2010·Granted Dec 1, 2015·0 cites·13 claims
- 3335US6986197B2Method of manufacturing an IC packageASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jan 17, 2006·0 cites·5 claims
- 3434US11227779B2Apparatus and method for processing a semiconductor deviceASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jan 18, 2022·0 cites·19 claims
- 3534US2005248041A1Electronic device with high lead densityATM TECHNOLOGY SINGAPORE PTE L·Filed 2004·Application pending·0 cites
- 3633US2004194803A1Cleaning of an electronic deviceASM TECH SINGAPORE PTE LTD·Filed 2003·Application pending·0 cites
- 3730US9947561B2Semiconductor encapsulation system comprising a vacuum pump and a reservoir pumpASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Apr 17, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →