Inventor · disambiguated record
Sunil Kumar Singh
Also filed as: SINGH SUNIL · SINGH SUNIL K · SINGH SUNIL KUMAR · SINGH SUNIL KUMAR S
63 granted patents·22 pending applications·1,020 citations·filing 1998–2024
98Inventor score
Files withGLOBALFOUNDRIES INC41GLOBALFOUNDRIES US INC11IBM5TAIWAN SEMICONDUCTOR MFG CO LTD5TAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
85 records- 0196US10347528B1Interconnect formation process using wire trench etch prior to via etch, and related interconnectGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 9, 2019·21 cites·12 claims
- 0296US10312188B1Interconnect structure with method of forming the sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jun 4, 2019·23 cites·17 claims
- 0395US8652962B2Etch damage and ESL free dual damascene metal interconnectSINGH SUNIL KUMAR·Filed 2012·Granted Feb 18, 2014·23 cites·10 claims
- 0494US9117822B1Methods and structures for back end of line integrationGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 25, 2015·16 cites·10 claims
- 0593US9786549B2Etch damage and ESL free dual damascene metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·6 cites·20 claims
- 0692US9576894B2Integrated circuits including organic interlayer dielectric layers and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 21, 2017·9 cites·20 claims
- 0791US6325808B1Robotic system, docking station, and surgical tool for collaborative control in minimally invasive surgeryADVANCED REALTIME CONTROL SYST·Filed 1998·Granted Dec 4, 2001·847 cites·32 claims
- 0889US9524935B2Filling cavities in an integrated circuit and resulting devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Dec 20, 2016·7 cites·13 claims
- 0988US10312136B2Etch damage and ESL free dual damascene metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·3 cites·20 claims
- 1088US10177029B1Integration of air gaps with back-end-of-line structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 8, 2019·5 cites·12 claims
- 1188US10084093B1Low resistance conductive contactsGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 25, 2018·6 cites·10 claims
- 1285US11515205B2Conductive structures for contacting a top electrode of an embedded memory device and methods of making such contact structures on an IC productGLOBALFOUNDRIES US INC·Filed 2019·Granted Nov 29, 2022·5 cites·16 claims
- 1385US11171041B2Etch damage and ESL free dual damascene metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·2 cites·20 claims
- 1484US9142451B2Reduced capacitance interlayer structures and fabrication methodsGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 22, 2015·6 cites·12 claims
- 1582US9318377B2Etch damage and ESL free dual damascene metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 19, 2016·3 cites·19 claims
- 1681US7682963B2Air gap for interconnect applicationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 23, 2010·9 cites·19 claims
- 1780US9691654B1Methods and devices for back end of line via formationGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 27, 2017·3 cites·11 claims
- 1878US10497610B2Dual photoresist approach to lithographic patterning for pitch reductionGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 3, 2019·2 cites·19 claims
- 1978US9353114B2Process for the preparation of dipeptidylpeptidase inhibitorsSINGH SUNIL KUMAR·Filed 2013·Granted May 31, 2016·2 cites·8 claims
- 2077US11955376B2Etch damage and ESL free dual damascene metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2176US9362162B2Methods of fabricating BEOL interlayer structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Jun 7, 2016·3 cites·20 claims
- 2276US9093501B2Interconnection wires of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·3 cites·20 claims
- 2375US8778794B1Interconnection wires of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 15, 2014·3 cites·20 claims
- 2475US6485975B1Method for regenerating viable and fertile citrus plants by tissue culture from explantsCOUNCIL SCIENT IND RES·Filed 2000·Granted Nov 26, 2002·7 cites·11 claims
- 2573US10832842B2Insulating inductor conductors with air gap using energy evaporation material (EEM)GLOBALFOUNDRIES INC·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 2671US10886287B2Multiple-time programmable (MTP) memory device with a wrap-around control gateGLOBALFOUNDRIES INC·Filed 2019·Granted Jan 5, 2021·1 cites·16 claims
- 2770US10818557B2Integrated circuit structure to reduce soft-fail incidence and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 27, 2020·1 cites·19 claims
- 2868US10580684B2Self-aligned single diffusion break for fully depleted silicon-on-insulator and method for producing the sameGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 3, 2020·1 cites·7 claims
- 2967US12453102B2Vertical memory devicesGLOBALFOUNDRIES US INC·Filed 2022·Granted Oct 21, 2025·0 cites·9 claims
- 3067US9593119B2Process for the preparation of dipeptidylpeptidase inhibitorsGLENMARK PHARMACUETICALS LTD·Filed 2016·Granted Mar 14, 2017·1 cites·5 claims
- 3166US10504774B2Lithographic patterning to form fine pitch featuresGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 10, 2019·1 cites·20 claims
- 3265US10169156B2Automatic restarting of containersIBM·Filed 2016·Granted Jan 1, 2019·1 cites·20 claims
- 3364US10735342B2Dynamic buffer allocation in similar infrastructuresIBM·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 3464US10735343B2Dynamic buffer allocation in similar infrastructuresIBM·Filed 2019·Granted Aug 4, 2020·0 cites·15 claims
- 3564US10453605B2Insulating inductor conductors with air gap using energy evaporation material (EEM)GLOBALFOUNDRIES INC·Filed 2017·Granted Oct 22, 2019·0 cites·14 claims
- 3662US11901304B2Integrated circuit structure with fluorescent material, and related methodsGLOBALFOUNDRIES US INC·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 3761US2025203888A1Multilayer metal-insulator-metal capacitors for increased capacitance densitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3859US10567305B2Dynamic buffer allocation in similar infrastructuresIBM·Filed 2017·Granted Feb 18, 2020·0 cites·12 claims
- 3958US11380622B2Method and related structure to authenticate integrated circuit with authentication filmGLOBALFOUNDRIES US INC·Filed 2020·Granted Jul 5, 2022·0 cites·18 claims
- 4057US11367750B2Vertical memory devicesGLOBALFOUNDRIES US INC·Filed 2019·Granted Jun 21, 2022·0 cites·18 claims
- 4157US2024186367A1Integration scheme for fabricating high precision, low capacitor with unlanded viaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4256US9960113B2Method to fabricate a high performance capacitor in a back end of line (BEOL)GLOBALFOUNDRIES INC·Filed 2017·Granted May 1, 2018·0 cites·6 claims
- 4355US10560396B2Dynamic buffer allocation in similar infrastructuresIBM·Filed 2017·Granted Feb 11, 2020·0 cites·8 claims
- 4454US11211448B2Capacitor structure with MIM layer over metal pillarsGLOBALFOUNDRIES US INC·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 4554US2023281643A1Decision support system for marketing mix modelingIQVIA INC·Filed 2022·Application pending·0 cites
- 4652US11699650B2Integrated circuit structure with capacitor electrodes in different ILD layers, and related methodsGLOBALFOUNDRIES US INC·Filed 2021·Granted Jul 11, 2023·0 cites·19 claims
- 4752US11348867B2Capacitor structure for integrated circuit and related methodsGLOBALFOUNDRIES US INC·Filed 2020·Granted May 31, 2022·0 cites·16 claims
- 4852US9293363B2Methods and structures for back end of line integrationGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 22, 2016·0 cites·7 claims
- 4952US2023290855A1Transistor structure having an air spacer and method for making the sameHEFECHIP CORPORATION LTD·Filed 2022·Application pending·0 cites
- 5051US10714380B2Method of forming smooth sidewall structures using spacer materialsGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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