Inventor · disambiguated record
Seok Han Park
Also filed as: PARK SEOK · PARK SEOK HAN
27 granted patents·8 pending applications·35 citations·filing 2006–2024
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD35
Top patents by PatentIndex Score
35 records- 0191US10679997B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·5 cites·18 claims
- 0290US10573652B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 25, 2020·7 cites·10 claims
- 0389US10998324B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 4, 2021·2 cites·20 claims
- 0485US10546810B2Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 28, 2020·3 cites·20 claims
- 0580US11165018B2Semiconductor device including data storage structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·19 claims
- 0680US10332894B2Semiconductor device comprising work function metal pattern in boundry region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·2 cites·19 claims
- 0779US10325802B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 18, 2019·3 cites·20 claims
- 0875US9768032B2Method of forming pattern and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 19, 2017·2 cites·20 claims
- 0971US12317467B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 1071US7573142B2Alignment key structure in a semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·5 cites·34 claims
- 1170US10727233B2Integrated circuit devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·1 cites·20 claims
- 1268US9721830B2Methods of manufacturing semiconductor devices including isolation layersSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·1 cites·14 claims
- 1368US2025220893A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1467US11963364B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1567US11476194B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 1666US10062581B2Methods of forming an isolation structure and methods of manufacturing a semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·1 cites·15 claims
- 1766US9659790B2Method of forming pattern and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 23, 2017·1 cites·20 claims
- 1864US11469252B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1963US11723290B2Semiconductor device including data storage structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·18 claims
- 2063US10937729B2Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 2161US2025081445A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2260US11031338B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 2360US2025107066A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US12512135B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 2557US2024334682A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2655US10916623B2Semiconductor device including capacitor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·0 cites·20 claims
- 2755US2024306404A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2855US2024315013A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2954US10950510B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·17 claims
- 3054US2023371243A1Semiconductor memory device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3146US11018020B2Method of fabricating an integrated circuit device by using a block copolymer to form a self-assembly layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 3241US9716047B2Method of measuring a substrate and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 25, 2017·0 cites·20 claims
- 3338US9779941B2Methods of forming patterns of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 3, 2017·0 cites·13 claims
- 3438US2018175143A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 3534US9934986B2Method of forming fine patternsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →