Inventor · disambiguated record
Andreas Duell
Also filed as: DUELL ANDREAS · DUELL ANDREAS A G
12 granted patents·1 pending application·82 citations·filing 1988–2017
87Inventor score
Top patents by PatentIndex Score
13 records- 0175US11326969B2Linearized micromechanical sensorBOSCH GMBH ROBERT·Filed 2017·Granted May 10, 2022·2 cites·10 claims
- 0271US4910519AElectronic volume correctorsROMET LTD·Filed 1988·Granted Mar 20, 1990·33 cites·25 claims
- 0363US6062088APressure sensorBOSCH GMBH ROBERT·Filed 1997·Granted May 16, 2000·24 cites·7 claims
- 0455US5703282APressure sensor for pressure detection in combustion chamber of internal combustion engineBOSCH GMBH ROBERT·Filed 1996·Granted Dec 30, 1997·21 cites·10 claims
- 0553US9503673B2Micromechanical component including an integrated photodiode and a microprojectorBOSCH GMBH ROBERT·Filed 2014·Granted Nov 22, 2016·0 cites·8 claims
- 0647US10001643B2Micromirror device and projection deviceBOSCH GMBH ROBERT·Filed 2015·Granted Jun 19, 2018·0 cites·13 claims
- 0746US7279759B2Membrane sensorBOSCH GMBH ROBERT·Filed 2004·Granted Oct 9, 2007·0 cites·13 claims
- 0844US10222609B2Micromirror arrangement and projection deviceBOSCH GMBH ROBERT·Filed 2015·Granted Mar 5, 2019·0 cites·20 claims
- 0944US8462415B2Connecting structure for micromechanical oscillating devicesPINTER STEFAN·Filed 2011·Granted Jun 11, 2013·0 cites·16 claims
- 1040US9935077B2Apparatus for eutectic bondingBOSCH GMBH ROBERT·Filed 2015·Granted Apr 3, 2018·0 cites·8 claims
- 1138US2005016288A1Micromechanical apparatus, pressure sensor, and methodFiled 2004·Application pending·0 cites
- 1237US6782756B2Micromechanical component and equalization methodBOSCH GMBH ROBERT·Filed 2001·Granted Aug 31, 2004·2 cites·12 claims
- 1335US9725311B2Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contactingBOSCH GMBH ROBERT·Filed 2015·Granted Aug 8, 2017·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →