Inventor · disambiguated record
Masashi Kumagai
Also filed as: KUMAGAI MASASHI
24 granted patents·16 pending applications·261 citations·filing 1992–2022
95Inventor score
Top patents by PatentIndex Score
40 records- 0192US6710181B2Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Mar 23, 2004·37 cites·3 claims
- 0290US6835241B2Surface treatment for copper foilNIKKO MATERIALS CO LTD·Filed 2002·Granted Dec 28, 2004·37 cites·4 claims
- 0383US7432335B2Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the sameNIKKO MATERIALS CO LTD·Filed 2006·Granted Oct 7, 2008·4 cites·2 claims
- 0482US7005055B2Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the sameNIKKO MATERIALS CO LTD·Filed 2003·Granted Feb 28, 2006·11 cites·4 claims
- 0581US7651783B2Surface treated copper filmNIKKO MATERIALS CO LTD·Filed 2002·Granted Jan 26, 2010·25 cites·5 claims
- 0678US7824534B2Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewithNIPPON MINING CO·Filed 2005·Granted Nov 2, 2010·1 cites·3 claims
- 0778US7045461B2Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using theseNIKKON MATERIALS CO LTD·Filed 2004·Granted May 16, 2006·20 cites·11 claims
- 0877US7678257B2Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the sameNIKKO MATERIALS CO LTD·Filed 2007·Granted Mar 16, 2010·1 cites·1 claims
- 0974US6731959B1Portable telephone set with hinged lidMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 4, 2004·66 cites·18 claims
- 1071US6916865B2Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resinsNIKKO MATERIALS CO LTD·Filed 2002·Granted Jul 12, 2005·6 cites·6 claims
- 1169US7094845B2Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the sameNIKKO MATERIALS CO LTD·Filed 2002·Granted Aug 22, 2006·7 cites·3 claims
- 1268US7777078B2Copper electrolytic solution and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2003·Granted Aug 17, 2010·4 cites·2 claims
- 1367US8182594B2Electroless nickel plating liquidHINO EIJI·Filed 2006·Granted May 22, 2012·5 cites·9 claims
- 1467US8084044B2Pseudomonas aeruginosa outer membrane protein PA0427TANAKA JIRO·Filed 2007·Granted Dec 27, 2011·2 cites·7 claims
- 1564US8568856B2Two-layer flexible substrateTSUCHIDA KATSUYUKI·Filed 2006·Granted Oct 29, 2013·1 cites·6 claims
- 1662US8449751B2Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the sameKUMAGAI MASASHI·Filed 2007·Granted May 28, 2013·0 cites·2 claims
- 1762US2024335874A1Pure copper or copper alloy powder for additive manufacturingJX NIPPON MINING & METALS CORP·Filed 2022·Application pending·0 cites
- 1861US7771835B2Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the sameNIPPON MINING CO·Filed 2006·Granted Aug 10, 2010·1 cites·8 claims
- 1961US7378160B2Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the sameNIKKO MATERIALS CO LTD·Filed 2005·Granted May 27, 2008·1 cites·4 claims
- 2060US5258522AImidazole-silane compounds and metal surface finishing agent containing the sameNIPPON MINING CO·Filed 1992·Granted Nov 2, 1993·21 cites·1 claims
- 2156US7144491B2Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2003·Granted Dec 5, 2006·5 cites·2 claims
- 2256US2010270163A1Copper electrolytic solution and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2010·Application pending·0 cites
- 2356US2010224496A1Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewithNIPPON MINING CO·Filed 2010·Application pending·0 cites
- 2454US6605356B2Metal surface treatment agent, and metal material coated with sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Aug 12, 2003·5 cites·6 claims
- 2553US6921577B2Water-based metal surface treatment agentNIKKO MATERIALS CO LTD·Filed 2002·Granted Jul 26, 2005·1 cites·8 claims
- 2651US2025320130A1Copper Oxide-Containing Powder, Conductive Paste, and Method for Producing Copper Oxide-Containing PowderJX METALS CORP·Filed 2022·Application pending·0 cites
- 2750US7300501B2Electroless gold plating liquidNIKKO MATERIALS CO LTD·Filed 2005·Granted Nov 27, 2007·0 cites·4 claims
- 2849US2010330100A1Pseudomonas aeruginosa-outer membrane protein pa4710MEIJI SEIKA KAISHA·Filed 2008·Application pending·0 cites
- 2946US2011110022A1Portable terminal device with waterproof structurePANASONIC CORP·Filed 2009·Application pending·0 cites
- 3045US2013004499A1Antibody against serotype e lipopolysaccharide of pseudomonas aeruginosaSYMPHOGEN AS·Filed 2011·Application pending·0 cites
- 3145US2009155279A1Pseudomonas Aeruginosa Outer Membrane Protein PA5158TANAKA JIRO·Filed 2006·Application pending·0 cites
- 3243US2013004500A1Antibody against serotype a lipopolysaccharide of pseudomonas aeruginosaSYMPHOGEN AS·Filed 2011·Application pending·0 cites
- 3343US2013045207A1Antibody against serotype g lipopolysaccharide of pseudomonas aeruginosaSYMPHOGEN AS·Filed 2011·Application pending·0 cites
- 3443US2010291070A1Type iii secretion system component protein pa1698 of pseudomonas aeruginosaMEIJI SEIKA KAISHA·Filed 2008·Application pending·0 cites
- 3543US2013022604A1Antibody against serotype b lipopolysaccharide of pseudomonas aeruginosaSYMPHOGEN AS·Filed 2011·Application pending·0 cites
- 3643US2013022603A1Antibody against serotype i lipopolysaccharide of pseudomonas aeruginosaSYMPHOGEN AS·Filed 2011·Application pending·0 cites
- 3743US2007123681A1Resin compositionNIKKO MATERIALS CO LTD·Filed 2004·Application pending·0 cites
- 3837US7109273B2Solid silane coupling agent composition, process for producing the same, and resin composition containing the sameNIKKO MATERIALS CO LTD·Filed 2003·Granted Sep 19, 2006·0 cites·11 claims
- 3934US2006011488A1Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the sameKUMAGAI MASASHI·Filed 2003·Application pending·0 cites
- 4031US2007131141A1Surface processing agent for tin or tin alloy materialMASATOKI TAMIHARU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →