Inventor · disambiguated record
Dominic Maier
Also filed as: MAIER DOMINIC
28 granted patents·7 pending applications·89 citations·filing 2010–2023
95Inventor score
Top patents by PatentIndex Score
35 records- 0194US8890284B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 18, 2014·17 cites·20 claims
- 0291US8828807B1Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compoundINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 9, 2014·11 cites·22 claims
- 0389US11195787B2Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 7, 2021·7 cites·12 claims
- 0489US9725303B1Semiconductor device including a MEMS die and a conductive layerINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 8, 2017·5 cites·17 claims
- 0588US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0688US10186468B2System and method for a transducer in an eWLB packageINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 22, 2019·6 cites·32 claims
- 0788US8421226B2Device including an encapsulated semiconductor chip and manufacturing method thereofMEYER THORSTEN·Filed 2010·Granted Apr 16, 2013·10 cites·24 claims
- 0885US11609180B2Emitter package for a photoacoustic sensorINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 21, 2023·2 cites·14 claims
- 0985US9099454B2Molded semiconductor package with backside die metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 4, 2015·8 cites·22 claims
- 1082US10435292B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·2 cites·21 claims
- 1181US9981843B2Chip package and a method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 1278US9368435B2Electronic componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 14, 2016·4 cites·26 claims
- 1376US11492249B2MEMS sensor, MEMS sensor system and method for producing a MEMS sensor systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 8, 2022·1 cites·25 claims
- 1473US9147585B2Method for fabricating a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·9 claims
- 1571US10546752B2System and method for a transducer in an eWLB packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 28, 2020·1 cites·14 claims
- 1670US10161908B2Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluidINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·2 cites·20 claims
- 1770US9275878B2Metal redistribution layer for molded substratesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·10 claims
- 1869US8990744B2Electrical measurement based circuit wiring layout modification method and systemINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 24, 2015·3 cites·30 claims
- 1965US11040872B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 2063US2022148951A1Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2161US11211298B2System and method for a transducer in an EWLB packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·0 cites·21 claims
- 2259US2024060944A1Chemo-resistive gas sensing device comprising a catalytic gas filter arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2356US10600690B2Method for handling a product substrate and a bonded substrate systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 24, 2020·0 cites·17 claims
- 2456US9487392B2Method of packaging integrated circuits and a molded packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 8, 2016·0 cites·18 claims
- 2555US2024182295A1Pressure transducer device with hybrid barrier structure and method for manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2651US9988262B2Temporary mechanical stabilization of semiconductor cavitiesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 5, 2018·0 cites·20 claims
- 2750US2019079055A1Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrostatic pressure of the fluidINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 2848US10056295B2Method for handling a product substrate, a bonded substrate system and a temporary adhesiveINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 21, 2018·0 cites·11 claims
- 2948US9806056B2Method of packaging integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·0 cites·17 claims
- 3045US9711462B2Package arrangement including external block comprising semiconductor material and electrically conductive plastic materialINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 18, 2017·0 cites·25 claims
- 3144US2024187770A1Monolithic sound transducer and environmental barrierINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3244US2024182297A1Micromechanical environmental barrier deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3343US11279120B2Device and method for debonding a structure from a main surface region of a carrierINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 22, 2022·0 cites·14 claims
- 3438US10626012B2Semiconductor device including a cavity lidINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 21, 2020·0 cites·27 claims
- 3536US2017283247A1Semiconductor device including a mems dieINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →