Inventor · disambiguated record
Cynthia S. Milkovich
Also filed as: MILKOVICH CYNTHIA S · MILKOVICH CYNTHIA SUSAN
15 granted patents·2 pending applications·735 citations·filing 1993–2007
95Inventor score
Top patents by PatentIndex Score
17 records- 0198US5729896AMethod for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solderIBM·Filed 1996·Granted Mar 24, 1998·185 cites·37 claims
- 0297US6399892B1CTE compensated chip interposerIBM·Filed 2000·Granted Jun 4, 2002·91 cites·20 claims
- 0393US6664637B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Dec 16, 2003·63 cites·26 claims
- 0492US6516513B2Method of making a CTE compensated chip interposerIBM·Filed 2002·Granted Feb 11, 2003·41 cites·13 claims
- 0587US6225206B1Flip chip C4 extension structure and processIBM·Filed 1999·Granted May 1, 2001·67 cites·17 claims
- 0686US6756680B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Jun 29, 2004·33 cites·20 claims
- 0785US6955982B2Flip chip C4 extension structure and processIBM·Filed 2003·Granted Oct 18, 2005·29 cites·21 claims
- 0879US6486415B2Compliant layer for encapsulated columnsIBM·Filed 2001·Granted Nov 26, 2002·20 cites·2 claims
- 0978US6100114AEncapsulation of solder bumps and solder connectionsIBM·Filed 1998·Granted Aug 8, 2000·54 cites·14 claims
- 1078US5759269AManufacturing flexible circuit board assemblies and printer for screening solder paste in such manufactureIBM·Filed 1995·Granted Jun 2, 1998·41 cites·4 claims
- 1177US5638597AManufacturing flexible circuit board assemblies with common heat spreadersIBM·Filed 1995·Granted Jun 17, 1997·42 cites·23 claims
- 1273US5969945AElectronic package assemblyIBM·Filed 1997·Granted Oct 19, 1999·33 cites·4 claims
- 1371US5831828AFlexible circuit board and common heat spreader assemblyIBM·Filed 1993·Granted Nov 3, 1998·32 cites·15 claims
- 1462US7278207B2Method of making an electronic packageIBM·Filed 2005·Granted Oct 9, 2007·1 cites·5 claims
- 1553US2007278654A1Method of making an electronic packageJIMAREZ LISA J·Filed 2007·Application pending·0 cites
- 1652US6961995B2Method of making an electronic packageIBM·Filed 2002·Granted Nov 8, 2005·3 cites·3 claims
- 1730US2001013423A1Flip chip attach on flexible circuit carrier using chip with metallic cap on solderFiled 1997·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Cynthia S. Milkovich files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →