Inventor · disambiguated record
Lawrence T. Lamont, Jr.
Also filed as: LAMONT JR LAWRENCE T · LAMONT LAWRENCE T JR
13 granted patents·1,068 citations·filing 1978–1991
95Inventor score
Top patents by PatentIndex Score
13 records- 0195US4756810ADeposition and planarizing methods and apparatusMACHINE TECHNOLOGY INC·Filed 1986·Granted Jul 12, 1988·152 cites·32 claims
- 0295US4680061AMethod of thermal treatment of a wafer in an evacuated environmentVARIAN ASSOCIATES·Filed 1982·Granted Jul 14, 1987·118 cites·19 claims
- 0393US4717461ASystem and method for processing workpiecesMACHINE TECHNOLOGY INC·Filed 1986·Granted Jan 5, 1988·396 cites·14 claims
- 0490US4457825ASputter target for use in a sputter coating sourceVARIAN ASSOCIATES·Filed 1980·Granted Jul 3, 1984·35 cites·5 claims
- 0585US4909314AApparatus for thermal treatment of a wafer in an evacuated environmentVARIAN ASSOCIATES·Filed 1987·Granted Mar 20, 1990·71 cites·40 claims
- 0685US4414086AMagnetic targets for use in sputter coating apparatusVARIAN ASSOCIATES·Filed 1982·Granted Nov 8, 1983·25 cites·12 claims
- 0784US4756815AWafer coating systemVARIAN ASSOCIATES·Filed 1979·Granted Jul 12, 1988·46 cites·22 claims
- 0883US5114556ADeposition apparatus and method for enhancing step coverage and planarization on semiconductor wafersMACHINE TECHNOLOGY INC·Filed 1989·Granted May 19, 1992·63 cites·31 claims
- 0983US4743570AMethod of thermal treatment of a wafer in an evacuated environmentVARIAN ASSOCIATES·Filed 1987·Granted May 10, 1988·61 cites·7 claims
- 1072US5281320AWafer coating systemVARIAN ASSOCIATES·Filed 1991·Granted Jan 25, 1994·46 cites·7 claims
- 1168US4673480AMagnetically enhanced sputter sourceVARIAN ASSOCIATES·Filed 1984·Granted Jun 16, 1987·13 cites·24 claims
- 1265US5024747AWafer coating systemVARIAN ASSOCIATES·Filed 1988·Granted Jun 18, 1991·27 cites·17 claims
- 1363US4170541ARotating resonator for large substrate tables in sputtering systemsVARIAN ASSOCIATES·Filed 1978·Granted Oct 9, 1979·15 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →