Inventor · disambiguated record
Eugen Milke
Also filed as: MILKE EUGEN
7 granted patents·15 pending applications·8 citations·filing 2011–2022
74Inventor score
Files withHERAEUS AMLOY TECH GMBH7HERAEUS DEUTSCHLAND GMBH & CO KG6HERAEUS MATERIALS TECH GMBH4HERAEUS MAT TECH GMBH & CO KG1HERAEUS MATERIALS SINGAPORE PTE LTD1
Top patents by PatentIndex Score
22 records- 0167US9589694B2Alloyed 2N copper wires for bonding in microelectronics devicesHERAEUS MAT TECH GMBH & CO KG·Filed 2012·Granted Mar 7, 2017·4 cites·8 claims
- 0266US9397064B2Aluminum alloy wire for bonding applicationsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2013·Granted Jul 19, 2016·3 cites·15 claims
- 0361US11214854B2Copper-based alloy for the production of bulk metallic glassesHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Granted Jan 4, 2022·0 cites·16 claims
- 0452US9214444B2Aluminum coated copper ribbonHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Dec 15, 2015·1 cites·24 claims
- 0544US11318649B2Injection molding system for the injection molding of amorphous metalsHERAEUS AMLOY TECH GMBH·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 0643US2015098170A1Aluminum coated copper bond wire and method of making the sameHERAEUS MATERIALS TECH GMBH·Filed 2013·Application pending·0 cites
- 0741US2023234132A1Simulation system for selecting an alloy, and a production process for a workpiece to be produced having amorphous propertiesHERAEUS AMLOY TECH GMBH·Filed 2021·Application pending·0 cites
- 0839US2023229834A1Method for determining at least one production parameterHERAEUS AMLOY TECH GMBH·Filed 2021·Application pending·0 cites
- 0939US2013142568A13n copper wires with trace additions for bonding in microelectronics devicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 1038US2016078980A1Copper bond wire and method of making the sameHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2014·Application pending·0 cites
- 1137US2022118511A1Robust ingot for the production of components made of metallic solid glassesHERAEUS AMLOY TECH GMBH·Filed 2020·Application pending·0 cites
- 1236US2023093303A1Method for adapting a component description of a workpiece to be produced with amorphous propertiesHERAEUS AMLOY TECH GMBH·Filed 2022·Application pending·0 cites
- 1335US2022161312A1Shaped parts having uniform mechanical properties, comprising solid metallic glassHERAEUS AMLOY TECH GMBH·Filed 2020·Application pending·0 cites
- 1435US2013140068A1Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics DevicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 1534US2016288272A1Coated wire for bonding applicationsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2013·Application pending·0 cites
- 1634US2013142567A1Doped 4n copper wires for bonding in microelectronics devicesHeraeus Materials Technology GmbH & Co·Filed 2012·Application pending·0 cites
- 1731US2015360316A1Coated wire for bonding applicationsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2013·Application pending·0 cites
- 1830US2017154863A1Copper bonding wire with angstrom (å) thick surface oxide layerHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 1929US9966355B2Aluminum coated copper bond wire and method of making the sameHERAEUS MATERIALS TECH GMBH & CO KG·Filed 2013·Granted May 8, 2018·0 cites·16 claims
- 2028US9236166B2Core-jacket bonding wireMILKE EUGEN·Filed 2011·Granted Jan 12, 2016·0 cites·6 claims
- 2128US2023092277A1System, method for indicating mechanical properties and computer-readable storageHERAEUS AMLOY TECH GMBH·Filed 2021·Application pending·0 cites
- 2226US2017200534A1Process for manufacturing of a thick copper wire for bonding applicationsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →