Inventor · disambiguated record
John Vivalda
Also filed as: VIVALDA JOHN
12 granted patents·207 citations·filing 2011–2023
91Inventor score
Top patents by PatentIndex Score
12 records- 0197US8437818B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2012·Granted May 7, 2013·75 cites·20 claims
- 0296US11508896B1Materials and methods for fabricating superconducting quantum integrated circuitsSEEQC INC·Filed 2021·Granted Nov 22, 2022·6 cites·21 claims
- 0395US9130116B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2013·Granted Sep 8, 2015·24 cites·20 claims
- 0494US8301214B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsTOLPYGO SERGEY K·Filed 2011·Granted Oct 30, 2012·69 cites·35 claims
- 0593US10833243B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2017·Granted Nov 10, 2020·8 cites·20 claims
- 0692US11991935B2Materials and methods for fabricating superconducting quantum integrated circuitsSEEQC INC·Filed 2022·Granted May 21, 2024·2 cites·20 claims
- 0792US9741920B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2015·Granted Aug 22, 2017·8 cites·20 claims
- 0891US11711985B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2021·Granted Jul 25, 2023·2 cites·20 claims
- 0984US9741918B2Method for increasing the integration level of superconducting electronics circuits, and a resulting circuitHYPRES INC·Filed 2014·Granted Aug 22, 2017·8 cites·23 claims
- 1081US10283694B2Method for increasing the integration level of superconducting electronics circuits, and a resulting circuitHYPRES INC·Filed 2017·Granted May 7, 2019·3 cites·20 claims
- 1179US11121302B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2019·Granted Sep 14, 2021·2 cites·21 claims
- 1276US12317757B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2023·Granted May 27, 2025·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →