Inventor · disambiguated record
Gina Hoang
Also filed as: HOANG GINA · HOANG GINA V
10 granted patents·2 pending applications·70 citations·filing 2000–2021
84Inventor score
Files withHenkel IP & Holding GmbH6DESIGNER MOLECULES INC2HENKEL AG & CO KGAA2Henkel US IP LLC1NAT STARCH CHEM INVEST1
Top patents by PatentIndex Score
12 records- 0189US9865551B2Methods to control wafer warpage upon compression molding thereof and articles useful thereforHenkel IP & Holding GmbH·Filed 2015·Granted Jan 9, 2018·8 cites·24 claims
- 0284US6750301B1Die attach adhesives with epoxy compound or resin having allyl or vinyl groupsNAT STARCH CHEM INVEST·Filed 2000·Granted Jun 15, 2004·54 cites·2 claims
- 0377US9305892B2Adhesive for electronic componentHenkel IP & Holding GmbH·Filed 2014·Granted Apr 5, 2016·5 cites·11 claims
- 0470US9200184B2Chain extended epoxy to improve adhesion of conductive die attach filmHenkel IP & Holding GmbH·Filed 2013·Granted Dec 1, 2015·1 cites·19 claims
- 0570US8378017B2Thermosetting adhesive compositionsDESIGNER MOLECULES INC·Filed 2006·Granted Feb 19, 2013·2 cites·11 claims
- 0650US12187843B2Liquid compression molding or encapsulant compositionsHENKEL AG & CO KGAA·Filed 2021·Granted Jan 7, 2025·0 cites·9 claims
- 0743US9780068B2Adhesive for electronic componentHENKEL AG & CO KGAA·Filed 2016·Granted Oct 3, 2017·0 cites·4 claims
- 0839US9362105B2Pre-cut wafer applied underfill film on dicing tapeHenkel IP & Holding GmbH·Filed 2013·Granted Jun 7, 2016·0 cites·12 claims
- 0938US9281182B2Pre-cut wafer applied underfill filmHenkel IP & Holding GmbH·Filed 2013·Granted Mar 8, 2016·0 cites·12 claims
- 1037US2013187095A1Thermosetting adhesive compositionsDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 1135US2014057411A1Dicing before grinding after coatingHenkel US IP LLC·Filed 2013·Application pending·0 cites
- 1231US9449938B2Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereofHenkel IP & Holding GmbH·Filed 2016·Granted Sep 20, 2016·0 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →