Inventor · disambiguated record
Simon John Molloy
Also filed as: MOLLOY SIMON · MOLLOY SIMON J · MOLLOY SIMON JOHN
52 granted patents·4 pending applications·714 citations·filing 1997–2024
98Inventor score
Files withTEXAS INSTRUMENTS INC32AGERE SYST GUARDIAN CORP6AGERE SYSTEMS INC6LUCENT TECHNOLOGIES INC5KOCON CHRISTOPHER BOGUSLAW2
Top patents by PatentIndex Score
56 records- 0198US9299830B1Multiple shielding trench gate fetTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 29, 2016·30 cites·20 claims
- 0297US5849639AMethod for removing etching residues and contaminantsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Dec 15, 1998·287 cites·17 claims
- 0396US8748976B1Dual RESURF trench field plate in vertical MOSFETTEXAS INSTRUMENTS INC·Filed 2013·Granted Jun 10, 2014·48 cites·19 claims
- 0495US9136381B1Super junction MOSFET with integrated channel diodeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 15, 2015·21 cites·18 claims
- 0590US6180518B1Method for forming vias in a low dielectric constant materialLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 30, 2001·100 cites·32 claims
- 0689US9905638B1Silicon epitaxy for high aspect ratio, substantially perpendicular deep silicon trenchTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 27, 2018·6 cites·20 claims
- 0787US8288820B2High voltage power integrated circuitKOCON CHRISTOPHER BOGUSLAW·Filed 2010·Granted Oct 16, 2012·10 cites·19 claims
- 0886US9356133B2Medium voltage MOSFET deviceTEXAS INSTRUMENTS INC·Filed 2013·Granted May 31, 2016·5 cites·10 claims
- 0985US9305852B1Silicon package for embedded electronic system having stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·6 cites·13 claims
- 1084US9711639B2Multiple shielding trench gate FETTEXAS INSTRUMENTS INC·Filed 2016·Granted Jul 18, 2017·3 cites·10 claims
- 1179US10256337B2Power transistor with terminal trenches in terminal resurf regionsTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 9, 2019·2 cites·20 claims
- 1277US9230851B2Reduction of polysilicon residue in a trench for polysilicon trench filling processesTEXAS INSTRUMENTS INC·Filed 2014·Granted Jan 5, 2016·4 cites·12 claims
- 1375US6046115AMethod for removing etching residues and contaminantsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Apr 4, 2000·38 cites·20 claims
- 1474US8294210B2High voltage channel diodeKOCON CHRISTOPHER BOGUSLAW·Filed 2010·Granted Oct 23, 2012·4 cites·10 claims
- 1574US6258610B1Method analyzing a semiconductor surface using line width metrology with auto-correlation operationAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jul 10, 2001·45 cites·12 claims
- 1673US10438936B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 8, 2019·1 cites·5 claims
- 1772US9484450B2Integrated channel diodeTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 1, 2016·2 cites·9 claims
- 1871US10741684B2Integrated channel diodeTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 11, 2020·1 cites·15 claims
- 1971US9721860B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 1, 2017·2 cites·9 claims
- 2071US9525035B2Vertical high-voltage MOS transistor and method of forming the sameTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 20, 2016·2 cites·22 claims
- 2169US11444191B2Integrated channel diodeTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 2269US10062624B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 28, 2018·1 cites·8 claims
- 2364US6472307B1Methods for improved encapsulation of thick metal features in integrated circuit fabricationAGERE SYST GUARDIAN CORP·Filed 2000·Granted Oct 29, 2002·10 cites·30 claims
- 2463US6656850B2Method for in-situ removal of side walls in MOM capacitor formationAGERE SYSTEMS INC·Filed 2002·Granted Dec 2, 2003·7 cites·8 claims
- 2562US11177246B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 2661US10672901B2Power transistor with terminal trenches in terminal resurf regionsTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 2761US9450082B2Integrated termination for multiple trench field plateTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 20, 2016·1 cites·11 claims
- 2860US12148354B2Spread-spectrum video transport integration with virtual reality headsethyPHY USA Inc·Filed 2022·Granted Nov 19, 2024·0 cites·21 claims
- 2959US6730600B2Method of dry etching a semiconductor device in the absence of a plasmaAGERE SYSTEMS INC·Filed 2002·Granted May 4, 2004·6 cites·15 claims
- 3058US10541326B2Multiple shielding trench gate FETTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 21, 2020·0 cites·20 claims
- 3158US7329605B2Semiconductor structure formed using a sacrificial structureAGERE SYSTEMS INC·Filed 2005·Granted Feb 12, 2008·1 cites·9 claims
- 3257US10811533B2Medium high voltage MOSFET deviceTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 20, 2020·0 cites·19 claims
- 3356US10553717B2Medium voltage MOSFET deviceTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 4, 2020·0 cites·19 claims
- 3456US9859261B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 2, 2018·0 cites·6 claims
- 3554US10573718B2Vertical high-voltage MOS transistorTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 25, 2020·0 cites·26 claims
- 3654US6585830B2Method for cleaning tungsten from deposition wall chambersAGERE SYSTEMS INC·Filed 2000·Granted Jul 1, 2003·1 cites·16 claims
- 3753US10153220B2Silicon package having electrical functionality by embedded passive componentsTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 11, 2018·0 cites·18 claims
- 3853US10121716B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 3953US9640519B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2015·Granted May 2, 2017·0 cites·6 claims
- 4053US6218085B1Process for photoresist rework to avoid sodium incorporationLUCENT TECHNOLOGIES INC·Filed 1999·Granted Apr 17, 2001·14 cites·20 claims
- 4152US10109614B2Silicon package for embedded electronic system having stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 23, 2018·0 cites·17 claims
- 4251US9818662B2Silicon package having electrical functionality by embedded passive componentsTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 14, 2017·0 cites·6 claims
- 4351US7741702B2Semiconductor structure formed using a sacrificial structureAGERE SYSTEMS INC·Filed 2007·Granted Jun 22, 2010·0 cites·20 claims
- 4451US6406999B1Semiconductor device having reduced line width variations between tightly spaced and isolated featuresAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jun 18, 2002·17 cites·15 claims
- 4550US9673317B2Integrated termination for multiple trench field plateTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 6, 2017·0 cites·20 claims
- 4650US7339274B2Metallization performance in electronic devicesAGERE SYSTEMS INC·Filed 2004·Granted Mar 4, 2008·4 cites·27 claims
- 4748US6395639B1Process for improving line width variations between tightly spaced and isolated features in integrated circuitsAGERE SYST GUARDIAN CORP·Filed 1999·Granted May 28, 2002·15 cites·22 claims
- 4848US2025124652A1Analog video transport integration with ar/vr headsethyPHY USA Inc·Filed 2024·Application pending·0 cites
- 4946US6458648B1Method for in-situ removal of side walls in MOM capacitor formationAGERE SYST GUARDIAN CORP·Filed 1999·Granted Oct 1, 2002·10 cites·20 claims
- 5043US9245994B2MOSFET with curved trench feature coupling termination trench to active trenchTEXAS INSTRUMENTS INC·Filed 2014·Granted Jan 26, 2016·0 cites·16 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →